Electronics Forum | Fri Aug 14 07:27:42 EDT 1998 | Earl Moon
| | Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | | Xingsheng | Xingsheng: Welcome. | Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill | Web resources: http://www.pw
Electronics Forum | Thu Feb 25 12:51:10 EST 1999 | SMT-ASSY
You can look up on the SMTnet directory for Training. Type in the search box "training" and then click on the search button. This should give you a list of all service provider which include training as part of their service to the industry. I am su
Electronics Forum | Thu Feb 25 13:17:21 EST 1999 | SMT-ASSY
Look up on the SMTnet directory for Training. Type in the search box "training" and then click on the search button. This should give you a list of all service provider which include training as part of their service to the industry. I am sure that
Electronics Forum | Wed Feb 25 01:24:34 EST 1998 | Steve Gregory
Dave, I confess I was a tad too general and a bit too extreme describing the way ALL solder joints look on palladium coated leads. I should been more specific about the "pillow-effect". I've seen it regularly with palladium coated leads on small SOT
Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep
We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f
Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Mon Nov 20 21:02:46 EST 2000 | Michael Psrker
First question I have for you is: Are you assuming that standard precautions are in place at your facility to minimize moisture content i.e. air- deionizers, vacuum sealed packaging, humidity control in storage and manufacturing? You do not mention
Electronics Forum | Mon Nov 27 19:32:02 EST 2000 | Michael Parker
Prof. Whoopee - amazing facts that you find on your 3-D BB, it has completely confounded my comrade, Chumley. Plainly spoken that around the SF Bay Area a.k.a. Silicon Valley(ever hear of the famous SF Fog?)during the winter months, near the coast a
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
