Electronics Forum | Mon Dec 21 10:20:47 EST 2009 | zanolli
We are looking to purchase a table top batch oven, with nitrogen, for prototype work on various PCB assy's - some with BGA's. The intent is to simulate a multi-zone production oven profile - and we kow that an exact simulation is not possible - just
Electronics Forum | Thu Feb 17 01:58:29 EST 2000 | Roni Haviv
Hi Richard, You can use "MOLE" profiler, an accelent profiling tool. Good luck, Roni
Electronics Forum | Thu Feb 17 01:58:29 EST 2000 | Roni Haviv
Hi Richard, You can use "MOLE" profiler, an accelent profiling tool. Good luck, Roni
Electronics Forum | Wed Jan 05 05:37:34 EST 2000 | Vishy
Hi smt team : I'm looking for info. on the Siemens productivity lift concept by actual users. Anyone has any info ? On a related topics , can anyone refer sites where there are papers on equipment utilization improvement ? SMT line Cycletime simul
Electronics Forum | Tue Oct 13 00:50:58 EDT 1998 | Hossam Alzomor
how to buy a used or new equipments for pcb industry and a good s/w for design and simulation Eng\Hossam Alzomor Egypt
Electronics Forum | Sat Oct 06 08:44:22 EDT 2001 | davef
�Control System Design And Simulation� Jack Golten, Andy Verwer; McGraw Hill College Div; 1991; Paperback; 388 pages; ISBN: 0077074122 [Amazon.com lists two of �em for $20 used.]
Electronics Forum | Wed Jan 30 06:45:01 EST 2002 | yaq
Hi, Has anyone done some research (measurement/simulation) on the effect of PWB vias on solder ball temperature of the component? Would this have some effect on solder joint reliability especially during power cycling? Any comments will be appreciat
Electronics Forum | Thu Jan 31 04:48:04 EST 2002 | yaq
Hi, Has anyone done some research (measurement/simulation) on the effect of PWB vias on solder ball temperature of the component? Would this have some effect on solder joint reliability especially during power cycling? Any comments will be appreciat
Electronics Forum | Thu Jul 14 16:38:13 EDT 2005 | sleech
Our present lab went "South." We need a lab that can do temperature/humidity conditioing, convection oven baking, C-Mode Scanning Acoustical Microscopic package inspection and "No-Pb" reflow simulation. We are evaluating a low temperature package dry
Electronics Forum | Wed May 17 17:27:58 EDT 2006 | smt_guru
My consultancy firm will perform a process capability analysis on your 0201 feeder performance characteristics. We will leverage and integrate various feeder designs utilizing electro-mechancial design modeling and simulation. Please consult us in
