Electronics Forum | Wed May 09 01:23:17 EDT 2001 | GregH
Hi, My Bottomside component pads are 1:1 with my topside land sizes/dimensions. I have difficulties catching solders on my bottomside smd chips (SMB Diodes, 0805 RC Chips). What should the bottomside components for wave soldering be greater than my t
Electronics Forum | Wed Jul 03 14:08:10 EDT 2002 | gbriceno
I' designing a PCB with SMD components to optimize the land patterns for wave soldering. I find that the IPC-SM-782 land patterns are not robust enough for wave soldering, yielding ramdom skips and bridges. This PCB will also give me insight on sha
Electronics Forum | Wed Sep 19 07:19:46 EDT 2012 | mbnetto
Hi Melissa, We mount this component in the bottom side with adhesive epoxy and the solder is done on the wave solder machine. During the wave solder machine, we have the problem as like the picture.. no solder in one of the pads...
Electronics Forum | Mon Jan 19 20:07:07 EST 2004 | russ
I once used some foil tape from 3M with hightemp adhesive. It actually sorta worked. Russ
Electronics Forum | Thu Sep 13 21:18:16 EDT 2012 | vergara1
Hello, I was looking at your photos of this diode. I have a two question and I'm sure it maybe a simple fix. One, Is the diode actualy touching the pad;reason I ask is, I see that theres excessive amount of adhesive underneth the part. Two, did you
Electronics Forum | Thu Aug 12 08:03:54 EDT 2004 | Rafal M.
We used fluxes: Cobar 94-QMB (no bismuth), RF800, Cobar94RXZ-M, with foam and spray fluxers: MBO clean alloy SN63PB37.experienced with changing preheatting, speed of covoyer single and double wave., we tried every combination. I think the problem is
Electronics Forum | Thu Sep 13 15:44:02 EDT 2012 | mbnetto
Hi everbody, I'm facing some soldering problems with a Diode (SMA) during wave soldering process. During this process almost all the time one of the component pads have no solder, according to the picture dsc000604 attached. Some considerations: * T
Electronics Forum | Wed Jul 03 15:58:16 EDT 2002 | davef
Your thinking is correct. Wave soldering pads that were designed for reflow can create problems: * Large pads used for reflow [too much solder] can create reliability problems. * Bridging [too much solder] creates rework. * Skipping & shadowing from
Electronics Forum | Tue Feb 24 18:33:59 EST 2009 | gregoryyork
It is probably due to the solder mask being undercured and is porous alowing the flux to be absorbed which boils when it hits the solder wave that kills the adhesion. You should be seeing this only over copper traces/tracks. Reduce flux volume and in
Electronics Forum | Mon May 29 02:15:06 EDT 2000 | Dreamsniper
Hi Buddy, We've tried shifting to this process before and from our point of view here are some of the advantage and disadvantages that we discovered. Advantage 1) Cheap Equipment cost as you just need to use your Solder Paste Printer rather than buy
