Electronics Forum | Tue May 23 21:14:22 EDT 2006 | davef
First, where the temperatures that aare mentioned in the original post measured? Second, it sounds like the PdAg component terminations are not seeing enough heat [your soldering iron touch-up proves this]. Your 232*C peak is the absolute minimum s
Electronics Forum | Fri Mar 23 10:00:38 EDT 2012 | isd_jwendell
I am a big fan of AIM SnPb solder paste. I currently use NC257-2 (no-clean, 89.5%), and recommend you include it in your evaluations.
Electronics Forum | Tue Mar 10 22:27:14 EST 1998 | DWR
What does the term "poor wetting" mean as a defect code ?
Electronics Forum | Fri Mar 23 03:41:19 EDT 2012 | grahamcooper22
try Almit Sn62 HM1 RMA V14L ....its the best no clean lead paste for wetting...I sell it and it has solved wetting problems many times when users have used other pastes
Electronics Forum | Thu Mar 22 13:06:50 EDT 2012 | smtmfgeng
Does anyone have any insight on alternatives to Indium NC-SMQ 92J solder paste for minimizing poor wetting on parts with oxidized leads (see datasheet here: http://www.dtsprocess.com/contents/articlefiles/6-SMQ92j.pdf). I am considering setting up a
Electronics Forum | Tue Nov 13 22:20:50 EST 2007 | davef
We'd add poor thermal recipe development, focusing on some QPF but not others that may a have a peculiar plating that requires extended time above liquidus.
Electronics Forum | Wed Mar 11 10:58:58 EST 1998 | Earl Moon
| | What does the term "poor wetting" mean as a defect code ? "Poor" should mean unacceptable when surface (component or PCB solder termination areas) wetting does not provide acceptable solder joints. Unacceptable wetting of PCB solder termination
Electronics Forum | Fri Sep 17 03:03:29 EDT 2010 | grahamcooper22
Hi Gani, looking at the HASL icture and the poor wetting of the solder over the pads I would imagine that the HASL coating is very thin on the pads and in actual fact isn't 'solder' but is tin /copper intemetallic and this has poor solderability. It
Electronics Forum | Mon Jan 29 12:42:24 EST 2001 | davef
Several points about your query are: * TI�s solderability protection specification is a minimum of 3 u" of palladium over 40-60 u" of nickel plate over a http://www.ti.com/sc/docs/products/logic/package/palladm/index.htm
Electronics Forum | Fri Apr 09 15:00:04 EDT 2010 | davef
So for your SMT1/SMT2/PTH boards, you have poor solderability during SMT2. [Even if you have no SMT2 and only ST1/PTH, our answer is the same.] We assume this occurs on one board part number only. We guess that your bare boards have insufficient gol
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