Electronics Forum | Thu Apr 22 12:27:47 EDT 2004 | barry
I placed thermo's at 2 of the problem devices. Soak (time 150 to 180) 100 sec. Time above 180 =80 secs with 208 deg. peak. The solder appeared to flow at these pads, but little to no adhesion to the joint.Total time in oven was 5 min. All other joint
Electronics Forum | Mon Aug 24 22:27:52 EDT 2015 | sarason
Your solder looks like it hasn't had time to reflow. Are`the pictures of an aluminium substrate ? So just positing a theory your boards need more soak time, the solder seems to have formed little hills/mountains and then cooled off before the surface
Electronics Forum | Wed Mar 15 09:28:30 EST 2006 | mapell
Vick I would not think what your seeing is normal. Just guessing without a profile but.... - not reaching peak temperature - not enough soak time or mild ramp to burn away the flux - shortened TAL, not allowing proper time for the solder to wet - lo
Electronics Forum | Fri Sep 07 12:19:20 EDT 2007 | guqing
We are having problem to develop lead-free (SAC305) reflow profile for big SMT electrolytic caps. The delta T of the joint of the cap with the rest of the board is too big to fit in the tighter lead-free window. Any suggestions regarding the total pr
Electronics Forum | Tue Mar 04 03:24:43 EST 2008 | reypal
I need some advise from those with experience on this component. We are facing soldering problem "pillow effect"(from cross section result)on this BGA. In the reflow profile point of view which area should we focused more? The soak time or the Total
Electronics Forum | Wed Jun 11 09:35:07 EDT 2008 | grics
Out of curiosity, what is your top side peak temp @ reflow? Have you inspected the boards prior to SMT (at your 5DX machine?) Also, have you tried to run the board through reflow with out any parts or bga placed and inspected? I how long are you in
Electronics Forum | Mon May 20 15:43:01 EDT 2013 | ngotranbestek
Hi I meet problem by PCB with diameter 300cm and thick 6mm i used tin-lead with profile normal, soak time 60-90 sec, Temp peak is 220 degree C, But solder see not good, not shiny. Any body recomend help me to fix this problem for Hard gold playing.
Electronics Forum | Mon May 20 11:19:34 EDT 2013 | jax
I don't get it... Who cares if the zones on your oven are 10° different or 100° different, if the oven you have will support it? The only thing that matters is the product you are building and the parameters in which you do it. Ramp Rate, Soak tim
Electronics Forum | Mon Feb 25 12:52:47 EST 2019 | emeto
Solved it last week! Thank you all for your help. PRoy I wish you posted that earlier :) it would have saved us time and effort. We did extend the soak time(from 65s to 80seconds) in the reflow profile which resulted in a better wetting and stronger
Electronics Forum | Sun Jul 26 20:54:40 EDT 1998 | Masdi Muhammad
Hi, Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subjecte
