Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann
Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied
Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run
Electronics Forum | Sat Jun 24 07:48:05 EDT 2017 | ranap121212
Thanks from your answer. A few days ago the supplier told me about these rolls. Now I am waiting for them and I will make tests. Maybe I will also try to reduce the ejection speed but this will lengthen the process
Electronics Forum | Wed Jun 21 09:12:42 EDT 2017 | emeto
I would start with checking the flux amount and trace and the thermal profile(preheating is important) for this assembly. Then I would consider changing to another flux and run it again.
Electronics Forum | Thu Jun 22 15:05:55 EDT 2017 | solderingpro
There are several different technologies in the industry today to assist in the out-gassing of flux cores. On automated soldering systems, there are two main types of perforating solder feeders: - Hole Drilling - "V" Scoring By perforating the so
Electronics Forum | Thu Jul 06 03:43:22 EDT 2017 | jamesbarnhart
Electronic devices required higher speed, I/O capability, and density to meet standard requirements. Automated robotic soldering solutions that meet the demands of applications are too challenging for hand soldering. Manual soldering, even with the m
Electronics Forum | Mon Jun 26 08:57:17 EDT 2017 | capse
If N2 is not an option, the cut wire feeder or drilled wire are your best bet for now. You need to optimize wire feed rate as well. The solder joint on the robot takes about the same time to form as in manual soldering. If you need to speed the solde
Electronics Forum | Fri Aug 24 13:21:59 EDT 2018 | babe7362000
What do others use as far as solder paste type, stencil thickness and aperature size for a .4mm Ball Pitch CSP. Ball diameter is .3mm. Please let me know your thoughts or what you use. Thanks
