Electronics Forum | Mon Nov 27 19:32:02 EST 2000 | Michael Parker
Prof. Whoopee - amazing facts that you find on your 3-D BB, it has completely confounded my comrade, Chumley. Plainly spoken that around the SF Bay Area a.k.a. Silicon Valley(ever hear of the famous SF Fog?)during the winter months, near the coast a
Electronics Forum | Wed Apr 13 13:40:27 EDT 2011 | jebs
Hi. the res/cap is mostly 805, solder paste will be led free and will only have a few fine pitch IC on each board. The boards will contain between 140 - 160 components and will run a production of 300 - 500 each day with only one or two different boa
Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.
Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va
Electronics Forum | Wed Apr 06 12:21:14 EDT 2011 | ripper
Hi, I am process engineer in PCBA factory.I have a question about gold plating on BGA.I want to know difference soldering performance between gold plating electrolytic and ENIG.Many thank for any idea.
Electronics Forum | Tue Feb 16 21:29:18 EST 2010 | actioncontrols
I predict you will have no problems with your soldering. Remember that all plating is only a few microns thick and quickly washed away by the molten solder. We have used white tin, immersion gold, OSG, etc. for quite a while with leaded solder and
Electronics Forum | Wed Sep 02 15:02:36 EDT 2020 | SMTA-64387501
We have recently received some pre-tinned "flat lead packages" and the question I have relates to the definition of solder touching the component body of the part. Typically when I have gold lead parts tinned there is a gold gap between the tinned po
Electronics Forum | Thu Sep 03 22:03:32 EDT 2020 | SMTA-64386139
Both conditions are acceptable for this bottom brazed flat pack package. The solder coverage must be within 0.070 inch of the lead/package interface per MIL-PRF-38535, paragraph A3.5.6.3.4.a. While that requirement could allow for a gold gap near t
Electronics Forum | Thu Apr 07 02:38:20 EDT 2011 | aungthura
I didn't know the difference for BGA. We found solderability probelm as show in attach.Then, we called to PCB maker and they said that it could be caused because of PCB finishing. Do you agree this probelm was happend because of PCB finishing? Unfor
Electronics Forum | Mon Sep 18 19:58:10 EDT 2000 | Dave F
broad answer. There's tons of suppliers. Go to "Circuit Assembly" magazine web site and look-up flux suppliers in the "Buyers Guide." Broad line suppliers are Kester, Alpha ... They will make you answer: I'm joining bla, bla, bla metals, using b
Electronics Forum | Thu Jul 03 18:14:03 EDT 2003 | russ
Kris, I don't know what I HAVEN'T SEEN yet cuz I haven't seen it. (HAHAHA) It is kind of like when you are looking for something and you always say after you found it that it was the last place you looked (Why would anyone keep looking for something
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