Electronics Forum: solder and paste and inspection and limit (Page 3 of 6)

Solder and flux

Electronics Forum | Wed Nov 06 05:13:01 EST 2002 | Dreamsniper

Crystalline flux if it is really clear should not be a problem. We were using Amtech paste before and we have the same results. Sometimes we mistakenly see it as a dry joint because of the reflections from the lighting of our Metcal inspection system

SMT Processing and gasketing

Electronics Forum | Tue Nov 11 16:30:08 EST 2008 | naynayno

Occasionally solder mask thickness is believed to be the cause of gasketing challenges during paste printing. We currently specific IPC-SM-840 on our fab drawings but this provides no limits or guidelines on thickness. I do not want to cause an unr

Solder Paste and Stencil questions

Electronics Forum | Tue Oct 12 11:47:51 EDT 1999 | Jose RG

Hi, We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? 2- Is anybody using step stenc

AOI selection,specifically ViTechnology and Mirtec

Electronics Forum | Wed Oct 26 14:20:41 EDT 2005 | TPM

Brian, We have the Mirtec Table Top. It is very good at detecting the component and orientation. It is however only as good as we program it to be. We have seen some limitations in respect to solder connections. I have not found it to be 100% re

Time and temp in lead and lead-free reflow

Electronics Forum | Mon Jul 28 14:30:22 EDT 2008 | grics

Take a look at this. Remember, these are only guidlines and can not replace any paste specs. As Real Chunks said, a profiler will be of HUGE help. We use this to determine what our top side temps are and to see if we have any problems with heat sen

SPI and AOI Machine Feaures.

Electronics Forum | Wed Feb 10 05:23:17 EST 2021 | karl_willoughby

Hello. I am sourcing machines for an SMT line (for the first time) and would like to understand features of current and earlier model SPI and AOI machines. In the intended application, a high volume of PCAs aren't required to be processed but there

How does temperature and humidity effect solder paste/printing

Electronics Forum | Wed Apr 11 22:05:58 EDT 2001 | davef

OA pastes are more hydroscopic than NC pastes. Hydroscopic. The capacity of a material to absorb and retain moisture from the ambient air. Sometimes this is compounded if you remove paste from the frig and let it warm to room temperature, because

board stretch and IPC -D-300G

Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef

Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.

Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan

Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have

SMT line expansion - new oven and selective solder

Electronics Forum | Sat Feb 22 11:37:00 EST 2020 | kylehunter

Hey all, I've made a post in the past about us expanding to a new space, but I wanted to do a new post with specific questions. We currently have a DEK 265, Phillips Opal Xii, and a Heller 1500. Our main reason for expanding is to have a lead-free


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