Electronics Forum | Thu Nov 17 03:34:51 EST 2005 | cangly
Hi, We have a board with over 100 chips (mixed size) and some long Connector DIP through out Wave solder with many issues of no solder and solder bridge, (using clean flux with bubble fluxer and Kester solder bar). Currently we tried to reduce the de
Electronics Forum | Thu Nov 17 13:13:49 EST 2005 | Mike
Hello, Some questions.... Are you running lead free? What alloy? What�s your pot temp at? Temp of the board after preheat? Are you getting any solder in the barrels (
Electronics Forum | Mon Nov 21 06:49:57 EST 2005 | pjc
Go to this link for a nice tool for wave solder process troubleshooting: http://www.speedlinetech.com/news_publications/application-notes.aspx?OnId=5 Look for "Wave Solder Troubleshooting Wizard" If you have an Electrovert machine, contact applica
Electronics Forum | Thu Nov 17 20:23:14 EST 2005 | cangly
Hi Russ, We control the gravity of flux each 8 hours and will mix thinner to balance it if any.. Do we need more any action for this.. Thanks for your advices.
Electronics Forum | Fri Nov 18 08:31:09 EST 2005 | jdengler
This is way too long of a time. The SG probably changes significantly over this time. This could be a major contributor to your problems. Jerry
Electronics Forum | Thu Nov 17 08:57:39 EST 2005 | russ
No clean and foam fluxing is not a very good process from my experience. I know that the flux manufacturers claim that they are suitable but I am not sure what "suitable" means. I would bet that you have very inconsistant flux coverage. How often
Electronics Forum | Thu Nov 17 20:51:16 EST 2005 | cangly
Morning Mike, We use Pb63/Sn37, Alpha Metal alloy. Solder pot is at 250 C. The profile of board after Preheat about 100 C, Lambda Wave about 220C (use both Lambda and Chip wave), DWell time 2.1s ~ 3s. Conveyor speed 1.5 in/min. We run by bare board a
Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
Electronics Forum | Thu Jul 06 03:43:22 EDT 2017 | jamesbarnhart
Electronic devices required higher speed, I/O capability, and density to meet standard requirements. Automated robotic soldering solutions that meet the demands of applications are too challenging for hand soldering. Manual soldering, even with the m
Electronics Forum | Wed Jun 21 11:30:27 EDT 2017 | ranap121212
but we do not have laminate preheating on robots. There is no flux separate application, the flux is in the soldering wire
