Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Sat Oct 09 04:17:21 EDT 1999 | Brian
| Can anyone tell me the formula/method to determine | the amount of weight that solder's surface tension can support. | (ie: Maximum weight of components soldered onto a bottom side | of a board during a top side reflow on a Paste/Paste process). |
Electronics Forum | Sat Oct 09 07:33:23 EDT 1999 | Dave F
| | Can anyone tell me the formula/method to determine | | the amount of weight that solder's surface tension can support. | | (ie: Maximum weight of components soldered onto a bottom side | | of a board during a top side reflow on a Paste/Paste proc
Electronics Forum | Sat Oct 09 09:18:21 EDT 1999 | Dave F
| | | | Can anyone tell me the formula/method to determine | | | | the amount of weight that solder's surface tension can support. | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | of a board during a top side reflow on a
Electronics Forum | Sat Oct 09 09:07:48 EDT 1999 | Brian
| | | Can anyone tell me the formula/method to determine | | | the amount of weight that solder's surface tension can support. | | | (ie: Maximum weight of components soldered onto a bottom side | | | of a board during a top side reflow on a Paste/Pa
Electronics Forum | Fri Jun 18 13:48:37 EDT 1999 | Earl Moon
| We currently use HASL on all of our boards and I would like to move to something else. I have sampled some boards with Entek OSP and I loved it, the problem is we have plated mounting holes on just about every board we make. Does anyone have info
Electronics Forum | Tue Oct 12 05:09:13 EDT 1999 | Brian
| | | | | | | Can anyone tell me the formula/method to determine | | | | | | | the amount of weight that solder's surface tension can support. | | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | | of a board during
Electronics Forum | Sat Oct 09 10:30:24 EDT 1999 | bix
| | | | | Can anyone tell me the formula/method to determine | | | | | the amount of weight that solder's surface tension can support. | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | of a board during a top side refl
Electronics Forum | Mon Oct 11 12:49:11 EDT 1999 | John Thorup
| | | | | | Can anyone tell me the formula/method to determine | | | | | | the amount of weight that solder's surface tension can support. | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | of a board during a top s
Electronics Forum | Tue Mar 29 14:45:12 EST 2005 | davef
IPC-TM-650 TEST METHODS MANUAL Number 2.4.21.1 Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials
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