Electronics Forum | Wed Apr 21 13:21:33 EDT 1999 | Scotty
Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The process
Electronics Forum | Wed Nov 07 18:37:27 EST 2001 | steven
sometime hand solder can cause also. no necessary have to be paste n reflow.:) now i'm facing bridging on 0402 components pads. any suggestions on spacing distance as we're going to re-design the pcb.
Electronics Forum | Mon Jan 04 22:09:57 EST 2016 | a290668789
It's amazing. I rarely saw that ENIG finish could be corroded. It should be the Nickel corroded issue and then affected the solderability. Not clear how to clear this, if you get the answer, let me know. good luck
Electronics Forum | Thu Mar 04 12:49:49 EST 1999 | SMTASSY
| Are square pads more difficult to wavesolder than round pads? | I am referring to a through hole board. | Usualy square pads are for indication of pin 1 on a DIP for example. There might be a difference in the capilary affect due to a different su
Electronics Forum | Wed Sep 21 08:43:46 EDT 2005 | kmeline
We are having problems with a 1210 cap moving as far as a 1/4 inch from its pads during reflow. We have verified the placement before reflow. They will tombstone some of the time. There are smaller and larger parts around this location and none of th
Electronics Forum | Wed Sep 21 20:03:34 EDT 2005 | kevinbooth
I am going to agree with Rob a little. It is also possible that a internal ground plane might be under or connected to the pads of this cap thus causing a increase in temp to this part during reflow. This can cause parts on occasion to jump from the
Electronics Forum | Wed Nov 07 11:56:44 EST 2001 | mparker
Pad spacing is just one element to consider. Your pad spacing is determined by the pitch (center to center distance between the leads). There are several good resources to find the appropriate pitch per device. Search the archives here or refer to th
Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas
* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo
Electronics Forum | Mon Aug 28 17:54:59 EDT 2000 | Steve Thomas
We're trying out 0603 packages on some 0805 footprints (at this stage only on some test boards) since our vendor tells us the 0805's are going to be getting harder to get, and more expensive to pay for. I understand the IPC footprint for the two is
Electronics Forum | Wed Nov 07 21:16:44 EST 2001 | davef
Consider using the following hierarchy of rules for pad design: 1. If you have a land pattern in a manufacturer�s data sheet, use it. 2. If the data sheet doesn't have a land pattern, but does have an RLP (registered land pattern) number or JEDEC n
