Electronics Forum | Thu Feb 24 23:11:51 EST 2011 | kemasta
HI I have this BGA short issue, I took x-ray image, the solder ball having big void. We suspect the pad on BGA was oxidie. Reject percentage quite low, only 5 out of 6000. But after the BGA re-ball, is work fine. Anyone have any idea to trobleshoot
Electronics Forum | Tue Apr 27 14:15:53 EDT 2004 | Kirk
thank you for suggestion but i need some more basic information i mean when should i use short tip or long tip, short is better to heat transfer but what about long one, there are curved solder tips what application? Kirk
Electronics Forum | Mon Feb 28 23:07:04 EST 2011 | kemasta
It is random. By the way, this board pass thought wave process, (BGA is at the top), will that cause the older short issue?
Electronics Forum | Tue Aug 04 12:15:33 EDT 1998 | Steve Gregory
| | | | I am looking for some design guidelines (length, width, spacing) for solder thieves which are placed behind trailing pins of wave soldered SOICs. I'd appreciate it if some one could direct me to the appropropriate reference. | | Also, has an
Electronics Forum | Thu Jun 26 13:24:25 EDT 2008 | realchunks
Do you glue SMT parts on the bottom? If so, use your SMT glue to prevent the short. Just cut a new stencil with 0.020" wide apertures between the pads of the connector (bottom side). We do it all the time.
Electronics Forum | Tue Aug 04 12:32:13 EDT 1998 | Bob Willis
The design rules for solder thiefs are that the extra pads must be bigger than the proceeding pads to be worth while as a minimum guide the pad is 3x the size of the proceeding pad so if the pad is 0.030" the thief would be 0.090" wide. As steve has
Electronics Forum | Fri Jan 22 16:16:17 EST 2010 | stepheniii
My old boss bought some stuff to clean the lead off of gold fingers. At least that is what he thought it did. What it really did was remove the gold fingers. And quite well I might add. The short answer to your question is no. And if you replate mak
Electronics Forum | Wed Feb 28 07:40:26 EST 2007 | realchunks
Hi Roderick, Guess it depends on how you define "minor". If it is just a visual blemish in the mask, there will be no affect o the BGA. If it is through the resist there may be a chance of solder shorting, which will affect it, I doubt it but poss
Electronics Forum | Tue Feb 14 09:35:25 EST 2006 | Baer
Let me give some information on the use of MS2. The average wave solder machine will use one liter per five day week per 8 hour shift. The usage can vary + or - 20%. Instead of removing 6 to 10 Lbs of dross every 3 hours you will have to remove 100 M
Electronics Forum | Wed Apr 14 05:44:36 EDT 2004 | hun
Hi All, Just have a share with you guy. We are using T4 solder paste and also E-Stencil. We ahd try out Alpha, Kester, AIM and Qualitek. The result show Alpha had a very very heavy stack flux and can't get it clean off even by chemical
