Electronics Forum: solder thief (Page 3 of 3)

Wave soldering STSOP32

Electronics Forum | Tue Oct 15 08:27:31 EDT 2002 | davef

I can't comment on 20 pitch TSOP, but wave soldering wider pitch parts require: * Orienting components with the leads perpendicular to the wave [moving parallel to the rails]. * Thieving [robbing] pads on trailing pads for the component. Search the

Wave Soldering SMT IC

Electronics Forum | Mon Oct 16 11:10:51 EDT 2000 | PeteC

Excessive bridging on SOICW-20, -16, SOIC-8, -14,-16. I've got a board, 4" x 6" w/ SOICs on bottom-side for wave solder. I've checked topside board temp for flux activation, wave height, wave surface with the glass check-plate going from 1" to 2" spa

Through-hole Connector Wave Solder Questions

Electronics Forum | Wed Feb 20 19:57:27 EST 2002 | davef

THIEVING * Layout: I�d guess the surface area of your thieves is not large enough. The pull from the thief is not great enough to over-come the pull from the connector pins and pads. Consider tripling the size of the thief. As you say, reducing t

Re: Standard pad sizes for reflow and wave

Electronics Forum | Sun Sep 05 03:52:11 EDT 1999 | Brian

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

SMD land patterns design for wave soldering

Electronics Forum | Wed Jul 03 15:58:16 EDT 2002 | davef

Your thinking is correct. Wave soldering pads that were designed for reflow can create problems: * Large pads used for reflow [too much solder] can create reliability problems. * Bridging [too much solder] creates rework. * Skipping & shadowing from

Re: Need help on DFM rules

Electronics Forum | Wed Jun 02 15:27:27 EDT 1999 | JohnW

| | Hi, | | | | To improve the Design For Manufacturing I am currently looking to write down some design rules that can (and should be) used by our engineering department. | | | | Can somebody help me get started or give some usefull tips on where

Re: Oooooh noooooo!!!

Electronics Forum | Tue Jun 08 15:04:06 EDT 1999 | JohnW

| | | Hi,my master | | | How to iron out such soldering bridge with below conditions: | | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | | 3.using s

Re: Fiducials

Electronics Forum | Mon Feb 22 14:02:17 EST 1999 | Michael Allen

We have resorted to adding a ring (or donut) around our 0.040" round fiducials. The donut acts as a "plating thief" to minimize the thickness of the copper plating (in the case of HASL finish) and of the solder plating (in the case of solder-plated

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