Electronics Forum | Wed Sep 12 14:08:37 EDT 2001 | caldon
PLEASE!!!! If that were the case then a 6 mil stencil is not a 6 mil stencil depending on paste, pressure, snap off...... We have and use the LSM 300 paste inspection to great degree of success (esp. for solder paste on semiconductor devices). So w
Electronics Forum | Wed Sep 12 17:57:29 EDT 2001 | CyberVilla
Cal, I can only respond by saying that the question relates to one important word "Reliable". If you feel that you have found the special touch to provide accurate and repeatable results, then I applaud your hard work. Also, a counter attack by co
Electronics Forum | Fri Jun 08 09:39:29 EDT 2001 | mriddle
Dear Mr. Chan, ASC International apologizes for any confusion or mis-representation you have experienced. It is unfortunate that we did not receive your email regarding local S'pore ASC distributors. If, after all this, you may still have an int
Electronics Forum | Wed Jun 07 09:26:09 EDT 2006 | amol_kane
can you also please tell us the section in IPC-610?...is this in RevD? also, does this also give the solder volume for BGAs? Thanks, Amol
Electronics Forum | Thu Jun 01 05:06:10 EDT 2006 | EC
Hi, I facing some 1005 component with poor wetting and look like not enough solder...... Is there any standard solder paste volume requirement. Appreciate all the input.
Electronics Forum | Tue Jun 06 17:00:36 EDT 2006 | pjc
Be carefull of the effect on other components with a 7mil stencil, like fine-pitch devices will bridge more, excess solder.
Electronics Forum | Fri Jun 02 08:50:47 EDT 2006 | russ
Hmmm interesting, we utilize 5 mil stencils and print to same height as you and do not experience these failures. May I ask what paste you are using and what the spacings are of your pad design? But anyhow, if it works it works.
Electronics Forum | Sun Jun 04 21:05:56 EDT 2006 | ec
Hi Russ, I could not send any attach file using smtnet.......anyway thanks your input.
Electronics Forum | Thu Jun 01 08:39:36 EDT 2006 | russ
IPC a 610 has this info. An 0402 however mat require more solder than what IPC states (basically evidence of wetted fillet for class2). more paste = more flux = better wetting. Why don't you tell us what pad sizes and layout you have and stencil t
Electronics Forum | Thu Jun 01 21:19:52 EDT 2006 | ec
Hi Russ, Thanks for your input. Currently, our stencil is at 5 mil thickness and the paste height from 5.5 to 6.5mil. I have increase the paste height to 7 to 7.5 mil and great improve....... I just need some data to present to my management and tel
