Electronics Forum | Thu May 23 03:10:43 EDT 2002 | ianchan
Hi mates, need your advise here. we have solderballs on a model due to neglect by stubborn folks to follow issued process control instructions. the post-reflow PCBA has solderballs stuck in the NC flux residue and is not in compliance to IPC-A-610
Electronics Forum | Wed May 12 08:35:20 EDT 2004 | solderpro
yes this paste is a pain in the paste.... there are very few reasons for solderballs, component to pad ratio and placement.... solder paste control, using a mixer, not hand mixing, checking viscosity and temp..... or simply and bad profile and your
Electronics Forum | Tue Sep 12 08:39:38 EDT 2017 | jefri_simorangkir
we are turning on the printer, suddenly the printer is off after checking there is solderball on pad capacitor component 0603 our question is what can a solderball stuck on one pad can when melting and causing shortsolder (being connected with other
Electronics Forum | Thu May 06 19:21:24 EDT 2021 | markhoch
Verify your aperture reductions in the stencil. Are the solderballs always in the same location? Same size & shape? Is the solder leaching through plated thermal holes from the opposite side of the PCB? Are you using stencil apertures designed to min
Electronics Forum | Wed Feb 03 17:39:41 EST 1999 | Rich Croteau
Name of equipment that automatically does the solderballing. Pads are .010" on .050" pitch
Electronics Forum | Tue Jun 04 10:39:45 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Tue Jun 04 10:39:54 EDT 2002 | jasonfang
Does anyone knows root cause of solderball after reflow? Thanks
Electronics Forum | Tue Feb 08 03:55:18 EST 2005 | Rob.
We got ours hooked on solderballs - 2 birds with one stone!
Electronics Forum | Mon Oct 27 14:28:19 EDT 2008 | patrickbruneel
Do you refer to the highlight in the picture as a solderball? Looks more like copper to me.
Electronics Forum | Tue Jun 15 13:36:30 EDT 2004 | John S
We are launching a new product and are fairly new to reflow soldering. A concern that has arisen is a fairly consistent solder ball that forms at an electrolytic capacitor. We changed to a homebase aperture design on our passives to eliminate mid-c