Electronics Forum | Mon Oct 03 12:11:18 EDT 2005 | PWH
Soon we will be manufacturing board assemblies on our SMT lines that will utilize both lead and lead free water soluable solder pastes. I have read some discussion about change-over from lead to lead-free jobs related to machine cleanliness, etc. H
Electronics Forum | Thu Oct 12 22:16:59 EDT 2000 | Dreamsniper
Hi Guys, I'd like to share this to all of you...you can start playing with the rests...Stated prices, if not indicated, are in Aussie $ or Singapore $. Stencil Printing Adhesive Pros a) Less Capital Equipment Cost (Short Term). In reality it is f
Electronics Forum | Mon Aug 14 13:08:00 EDT 2023 | dimamalin
Similar issues arose for me in cases where the contact pads of components were located below the solder mask level. Ordering a thinner stencil might potentially solve the problem.
Electronics Forum | Tue Aug 30 10:46:27 EDT 2005 | lyrtech
Hi, I curently have an interesting challenge. But I don't have all the knowledge to solve it. One of our boards is used in RF applications. We noticed that the No-Clean flux residue makes interferences in the RF signal. Removing the flux residue so
Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks
Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem
Electronics Forum | Fri Mar 06 10:46:35 EST 2009 | davef
First, we agree with Loco that your QFP is nonwetting, rather than dewetting. Your sceen-shots look like ol' timey SnPb paste recipes. Turn-up the heaterometer dial. Second, on nitrogen: * We kinda think your O2 needs to be around 100ppm with 99.99%
Electronics Forum | Wed Sep 18 19:43:12 EDT 2002 | dragonslayr
One more variable I've remembered - pad height with respect to solder mask height. Pads being too low can cause stencil "gasketing" problems that in turn allow more paste to be deposited than needed. Are your fabs HASL or some other media?
Electronics Forum | Thu Sep 19 11:14:45 EDT 2002 | Jim M.
We had lots of problems with bridging on 15.8mm pitch, QFP17-160 at the start.The board was .032 thick, double sided-six boards to a panel. Here is the problems (not neccessarily in the biggest to little but as i remember them) and solutions that he
Electronics Forum | Fri Apr 20 15:27:00 EDT 2001 | jimlew
We do some aperture reductions - but it's not the 10% i'm accustomed to. Looks like it should be more than we currently do (I think we do 10% of length, but no width). Don't think we have a slumping problem, and we're not doing snap-off, only contact
Electronics Forum | Fri Jul 06 13:44:15 EDT 2007 | shrek
Krikies! seems like a head-scratcher if I may say so me-self. I would say the other ogre is right, that surface finish will play a big factor in your solder joint's grain structure or how shiney 'tis. Non-HASL bearing finishes will typicaly exhibit
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