Electronics Forum | Wed Nov 14 01:00:20 EST 2007 | reypal
recently, we also have problem with QFN around 3% defect related to soldering. from the cross section it turns out to be solder crack. it could be the paste volume on the center pad is too much causing QFN to float that eventually will cause crack on
Electronics Forum | Wed Sep 19 07:19:46 EDT 2012 | mbnetto
Hi Melissa, We mount this component in the bottom side with adhesive epoxy and the solder is done on the wave solder machine. During the wave solder machine, we have the problem as like the picture.. no solder in one of the pads...
Electronics Forum | Thu Sep 13 18:00:35 EDT 2012 | mark25y2001
possible problem are loading orientation, solder flow cannot reach the pad portion due to trap of the body of the diode... or try to adjust turbulent but observe overflow... because turbulent are penetrate solder to pad and terminal of the diode. ho
Electronics Forum | Thu Sep 13 15:44:02 EDT 2012 | mbnetto
Hi everbody, I'm facing some soldering problems with a Diode (SMA) during wave soldering process. During this process almost all the time one of the component pads have no solder, according to the picture dsc000604 attached. Some considerations: * T
Electronics Forum | Fri Sep 14 06:17:48 EDT 2012 | mbnetto
Hi Melissa, thanks for you reply... I'll increase the placement force on this component so that it touchs better the board pad. Maybe it couldnt help due to stencil aperture. Maybe I'll have to change it. If you have more ideas, please share with m
Electronics Forum | Wed Aug 27 11:25:11 EDT 2008 | blnorman
We use immersion tin boards and ENIG with Sn63Pb37 with no problems. We did have to tweak the profile higher with ImmSn though.
Electronics Forum | Fri Sep 14 06:12:41 EDT 2012 | mbnetto
Hi Arturo. Thanks for you reply. The board is being loading so that the wave bath touch the 2 pads at the same time... I increased the chip wave in a maximum accepted level... One more rpm on the pump the wave sill overflow the board... Thanks...
Electronics Forum | Thu Sep 13 21:18:16 EDT 2012 | vergara1
Hello, I was looking at your photos of this diode. I have a two question and I'm sure it maybe a simple fix. One, Is the diode actualy touching the pad;reason I ask is, I see that theres excessive amount of adhesive underneth the part. Two, did you
Electronics Forum | Fri Sep 14 12:32:25 EDT 2012 | mark25y2001
just check if the pad and component terminal was traces of solder, if have? try to reduce preheat temp and solder bath temp... reason why solder not adhere because of component lead type, if more heat you apply solder flows and not completely adhere.
Electronics Forum | Sun Apr 24 09:12:00 EDT 2005 | davef
We're not sure what your customer is talking about either. Gold and tin form an intermetallic compound [IMC] that can cause poor solder connections. To minimize the potential of a problem, keep gold to less than 3 percent of the metal. [Search the
