Electronics Forum | Mon Feb 02 07:55:37 EST 2004 | pjc
Rick, Ultrasonics can damage some components that react to the mechanical action of the ultrasonics inside the device. Some component mfr data sheets will comment on ultrasonics. Better safe than sorry. Dean makes a good point if you can change so
Electronics Forum | Thu Aug 11 16:20:54 EDT 2005 | pjc
I have seen good results on OmniFlo 5 for Pb Free solderpastes PROVIDED the boards are low to medium thermal mass and have no high conveyor speed (high production) requirements. Max peak temp you can set on O5 is 280C, enough to get 230C on-board tem
Electronics Forum | Mon Aug 26 20:35:08 EDT 2002 | davef
There are no industry standards for eutectic solder-paste in conjunction with the life span of solder-paste. Whatever that is. Speaking of that ['whatever that is.'], what do you mean by �life span of solder-paste�? Is that: * Shelf life? * Workin
Electronics Forum | Wed May 21 13:38:22 EDT 2008 | pjc
Solderpaste types have a big effect on print performance. Go to this link to see if the solderpaste you are using has been tested, see "Rheometric Pump Paste Tests" under MPM: http://www.speedlinetech.com/news_publications/application-notes.aspx?OnI
Electronics Forum | Thu Feb 05 15:12:58 EST 2004 | pjc
There is the IPC/JEDEC J-STD-033 that addresses moisture sensitive components. Go to http://www.ipc.org for the standard. Your factory/storage area environment will dictate exposure times allowable. Be mindful of temperature and humidity changes- lik
Electronics Forum | Thu Mar 08 16:02:18 EST 2001 | gsmguru
Have you considered a different solderpaste ? A different flux chemistry may help. The metals content wouldn't have to change. Just go after a slightly more aggressive flux.
Electronics Forum | Mon Mar 12 12:07:02 EST 2001 | ramigary
Hi Daniel: I had a similar problem, we haven't PGAs but Have another big component. we change our process adding solderpaste by this side. I don't know what you think about it, but was our solution of this problem. Excuse my English. Ramon I
Electronics Forum | Thu Sep 02 11:50:58 EDT 1999 | ScottM
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Insufficient solderpaste. "No flux" (sat too long after print). Those are what I've experienced. Cheers, Scott
Electronics Forum | Thu Jan 03 02:26:12 EST 2002 | arzu
Hello, I need to know the volume spread of solderpaste after screenprinting fine-pitch paste using a nickelformed screen. It is the end-result that counts , so of course the spread of metalcontent in the paste is important too. Can anyone tell me som
Electronics Forum | Fri Feb 21 16:03:00 EST 2003 | pjc
Is anyone out there dispensing no-lead paste with a machine? If so, please give me some feedback- do you see any difference in performance vs. lead content paste? What type of valve/pump are you using. Thx in advance.
