Electronics Forum | Mon Oct 01 16:55:27 EDT 2001 | davef
I agree. Poor soldering technique is the most straightward way of creating solder balls during hand soldering operations.
Electronics Forum | Fri Nov 10 16:09:18 EST 2006 | realchunks
When you say "Displacement Soldering" do you mean selective soldering? Also known as spot soldering?
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Electronics Forum | Mon Nov 17 14:14:15 EST 2003 | blnorman
The main function of the test is to evaluate the solder mask. Basically you are testing three samples: #1 - No solder mask, #2 - solder mask without solder, and #3 solder mask with solder. The solder pot is used to apply solder to the patterns on O
Electronics Forum | Wed Jan 07 07:16:25 EST 2004 | davef
Cold solder prior to properly performing a well designed drop test. Actually, "cold solder" means different things to different people. Two dull solder connection conditions are: * "Disturbed" solder joint: a solder joint that has an "angular face
Electronics Forum | Thu Apr 05 11:48:25 EDT 2012 | pbarton
Are you running individual point soldering on each component lead, of are you drawing lines with the solder fountain to increase the speed of the process? Could be that if you are drawing lines, coupled with the very low flux levels you say you are
Electronics Forum | Mon May 10 11:24:33 EDT 2004 | Charly
Encounter solder ball crack after reflow, found the solder ball is out of shape after reflow, cross section view found that the solder mask opening is not good ( when we do comparason with diff. supplier substrate.) Does the solder mask shape will af
Electronics Forum | Wed Sep 05 08:06:08 EDT 2007 | davef
The gold needs to go into the solder so the solder can form a connection between the the component and the nickel under the gold. The gold will disperse into the solder. Most of it will remain in your solder pot after board processing. Assess the c
Electronics Forum | Mon Dec 11 15:50:01 EST 2000 | externet
Hi ! Try fresh DRY solder paste... Keep solder paste in a sealed container until the moment of use. Humidity absorbed by the soldering paste becomes vapor violently at the moment of heating it , expelling the solder in form of balls everywhere.
Electronics Forum | Thu Jul 22 09:57:43 EDT 2004 | ronih
Hi, Does anyone have experience Or any information regarding Wave Soldering with Lead free alloys ??? - Solderability of SMT glued components & TH solderability and capillarity ? - Bridgind and skiping/opens ? - Solder sorface apearence ? - reac
