Electronics Forum | Mon Oct 14 14:11:39 EDT 2013 | island2013
Yes, I agree with Evtimov. It's more about aperature reduction and type than it is the type of machine. Aspect and and Area Ratio are very important. Take a look at this page I found on the internet http://www.qualiecocircuits.co.nz/stencil-techno
Electronics Forum | Mon May 21 17:34:22 EDT 2001 | davef
Continuing the line of Michael's, the previous poster, comments ... The more Krispy Kremes, the better. Yeth!!! The more beer, the better. Yeth!!! The more epoxy, the better. Uh, I don think so!!! We look at this from a papa bear, mama bear, bab
Electronics Forum | Fri Mar 02 12:23:57 EST 2001 | kerryn
I recommend that you checkout the OnBoard Forum on Stencil Cleaning. You have to enter it via the SMTnet Home Page. I tried going through the OnBoard Forum link and could not see the data. Must be a software glitch. However, there is more informatio
Electronics Forum | Mon Jun 29 11:15:12 EDT 2009 | davef
Here on SMTnet, we've talked about using toaster ovens to reflow solder paste previously. Search the fine SMTnet Archives for more. Here's a clip from one of those threads: Look here: http://www.pcbexpress.com/stencils/stencil_article_page1.htm
Electronics Forum | Wed Feb 21 09:44:02 EST 2001 | markkrmp
Bill, Are you recommending the heat range of 95-100F (35-38C)to clean stencils with the Smart Sonic using the 440-RT SMT Detergent? The reason I am asking is were are looking at potentially the Model 2003 to clean our paste stencils and our adhesive
Electronics Forum | Sat Jun 04 08:51:26 EDT 2005 | pjc
IPC-7525 is a document that provides guidlines for the design and fabrication of stencils for solder paste and surface-mount adhesive. This is the first time this important information has been collected and published in an industry consensus documen
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Wed May 22 12:00:13 EDT 2019 | gregoireg
Thanks. It starts to make sense. There is a formula at the bottom of this page: http://www.circuitinsight.com/programs/50456.html It says: Stencil Thickness = 2.64mil + 0.0831 * pitch of component in mil. for 1.13mm, that gives exactly 0.16mm. So,
Electronics Forum | Mon May 02 18:54:28 EDT 2005 | MikeaJ
The answer you are looking for is part of your initial setup of the board and stencil. This information is to be found in the PCB setup menu/icon. The reason why the stencil loading pins are impacting the frame is because the default setting of the s
Electronics Forum | Mon May 02 12:35:33 EDT 2016 | adamjs
Or try : http://www.sipad.com/ I think sipad is incredibly cool and would be the perfect solution, but is way too expensive. We're paying $0.80/each for four-layer ENIG boards, 50cm^2 with 0.125mm trace/space and 0.8mm-pitch LGA landings in lots of
