Electronics Forum: stop and baking and boards (Page 3 of 7)

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

Zevatech or Juki 720 Pick and Place

Electronics Forum | Wed Nov 03 16:16:32 EDT 2010 | briansmi1116

I have a Zevatech 720 that was working great until one day a "E9001 the emergency stop button has been pressed..." error popped up when I turned the machine on. We traced out the circuit and found out what board it went to. I found a replacement an

OSP and getting full pad wetting??

Electronics Forum | Fri Apr 18 18:06:47 EDT 2014 | davef

Methods that can reduce the wettability of OSP: * Previous heat cycles * Previous cleaning cycles * IPC-1601 "Printed Board Handling and Storage Guidelines" says do not bake prior to soldering * Using improper handling methods BR ... davef

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Jan 25 21:14:08 EST 1999 | Dave F

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

Process control, SMT inspection and rework

Electronics Forum | Fri Apr 12 15:48:33 EDT 2002 | jersbo

SPC for each assembly(I use C(for board defects)NP(for unit defects) at the end of reflow to determine process capabilities determine Control limits. Once control limits are set, inspectors stop the process until out of control limit is addressed and

Electronic Assembly - PCB cleansing and COVID-19

Electronics Forum | Mon Mar 30 13:14:41 EDT 2020 | dwl

Heat above 53 Celsius kills covid viruses according to the WHO: https://www.who.int/csr/sars/survival_2003_05_04/en/ If you want an added measure of safety, you could bake your boards before packing them. Fundamentally its going to be an issue of

Nub bying p&p, stencil printer and reflow.

Electronics Forum | Mon Apr 18 10:07:19 EDT 2011 | wrongway

Hello Jebs we started out that way but the more handaling of the pcb the more problems you will have if you can do it in line and have the pcb's stop at some of the conveyors you can do some inspection. yes all of our machine's are in line now we lo

Puzzling CSM84VZ errors, #118 and #120

Electronics Forum | Mon Nov 14 00:13:55 EST 2011 | tpappano

Hi Jeff, I pulled the proms from both machines, copied to disk, re-burned the the old versions with the newer and reinstalled. The ram became scrambled in the upgraded unit on startup, but I did a full restore through the serial port and unit #2 got

Re: Humidity Control and Moisture Sensitivity

Electronics Forum | Tue Dec 05 15:10:55 EST 2000 | Francois Monette

Victor, here are a few more elements of information to answer your question. Both the temperature and relative humidity on the manufacturing floor have a significant impact relative to the rate of diffusion of moisture inside a plastic package and t

Selective soldering pallets and solder balls

Electronics Forum | Thu Dec 05 11:04:27 EST 2002 | slthomas

They're IR, bottom side only. Frankly wave solder is not my forte (there are those that would claim nothing is), but I've personally been tasked with developing a process to do reliable, high volume bottom side SMT, so I'm drawing a lot from the tec


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