Electronics Forum | Mon Apr 19 10:14:12 EDT 1999 | Justin Medernach
| | | Hi, | | | I just cheesed my previous attempt at this. I looked through IPC 600 and couldn't find anything relating to dimensional stability of a board with regard to stretch. I found bow and twist but nothing on size. I have a PCB that is .0
Electronics Forum | Fri Apr 13 07:25:06 EDT 2007 | davef
Your paste should meet the mid-point of outside lead bend. If you cannot meet that, IPC-A-610D, 8.2.5.6 defines the minimum. We agree that it gets confusing when you post multiple threads on the same or very similar topic.
Electronics Forum | Wed Feb 04 06:26:20 EST 2009 | sachu_70
Hi Peter, The defect you observe during the second side reflow could be caused due to improper Au plating thickness in the PCB fabrication process. You can refer IPC-2221 wherein plating thicknes for ENIG mentions 0.08um to 0.23um for Immersion Gold,
Electronics Forum | Thu Mar 22 17:33:38 EST 2001 | davef
Steve, IPC TM-650 Test Methods Manual is a load. IPC TM-650 Test Methods Manual: Section 2.1 Visual Test Methods Section 2.2 Dimensional Test Methods Section 2.3 Chemical Test Methods Section 2.4 Mechanical Test Methods Section 2.5 Electrical Test M
Electronics Forum | Fri Dec 18 22:37:09 EST 1998 | phillip hunter
| Okay here is the deal. I am fairly new to the company here, but one thing I have noticed is that we read way to many fiducials, in my opinon anyway. One for example is this. One assembly was reading 17 fids. Smallest pitch was .25mil I say you
Electronics Forum | Wed Oct 20 14:24:32 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
Electronics Forum | Wed Oct 20 14:44:24 EDT 2004 | Steve Gregory
It all depends where the voids are, and that's tough to do with a transmission x-ray. One needs to be able tilt the assembly at 45-degrees during x-ray, so you can get an idea where the void is. Or, you spend some big bucks for an x-ray laminography
Electronics Forum | Sat Jun 19 08:37:25 EDT 1999 | Dave F
| There is a PCB with SMD components glued on bottomside. When I make tests for checking the resistance of glue the result is a break in the surface of PCB. | | How can I measure the surface resistance of PCB surface? | How can I increase this resis
Electronics Forum | Wed Jun 16 14:14:07 EDT 1999 | Dave F
| Hello, | I am looking for the surface resistivity and volume resistivity of standard fr4 as a function of temperature and /or humidity . can any one help? | Frank: Sorry I'm so late getting back to you. 1 Use either ASTM D5109-94 or IPC-TM-6
Electronics Forum | Fri Jun 18 03:31:38 EDT 1999 | Frank
| | Hello, | | I am looking for the surface resistivity and volume resistivity of standard fr4 as a function of temperature and /or humidity . can any one help? | | | | Frank: Sorry I'm so late getting back to you. | | 1 Use either ASTM D5109-
IPC is the trade association for the printed wiring board and electronics assembly industries.
Training Provider / Events Organizer / Association / Non-Profit
3000 Lakeside Drive, 309 S
Bannockburn, IL USA
Phone: 847-615-7100
