Electronics Forum: temperature problems (Page 3 of 94)

Tin HASL finish soldering problems

Electronics Forum | Fri Sep 17 03:13:00 EDT 2010 | grahamcooper22

In HASL pcb coating you need to fully coat the pads with solder and then blow off any excess solder to leave a nice coating on each pad. Generally pcb manufacturers try to give you a flat pcb pad to make your solder paste printing more consistent. To

How does temperature and humidity effect solder paste/printing

Electronics Forum | Wed Apr 11 19:32:39 EDT 2001 | Adam

I'm trying to find information/articles describing the effects of temp and humidity on solder paste. Just recently we have gone through a change outside temperature and humdidty and have notice solderabilty problems with smt boards.

localization of the temperature sensors on the pcb

Electronics Forum | Fri Jan 30 04:36:11 EST 2009 | sachu_70

Hope your problem is resolved. Else I could provide some details if wanted. Pl. confirm.

Re: High temperature solder paste for gold plated MCMs

Electronics Forum | Thu Jan 27 14:49:53 EST 2000 | Glenn Robertson

Tuan - One of the reasons I suggested pre-tinning (aside from the negative effects of Gold on appearance and reliability) is the known slower wetting of Sn/Ag and Sn/Cu alloys as compared to Sn/Pb. If you don't have to be Lead-free, the high Lead

Quad oven-Need "offset.exe" s/w to calibrate temperature offsets

Electronics Forum | Tue Oct 06 14:29:14 EDT 2015 | cadco

Update 6 Oct 15: We have completely re-configured the oven PID boards such that everything is now visible on the oven by the s/w and all is now OK since the "Machine"card is now recognized. We have just one additional procedure to do and that is to

Solder-ability problems with SN100C Lead Free HASL

Electronics Forum | Thu Oct 05 11:59:51 EDT 2006 | Mario Scalzo, SMT CPE

Good afternoon all! Theoretically, there should not be any issues soldering to the SN100C as the tin content of the molten paste alloy should wet to the finish with no problem. I would just ensure that the peak temperature of the joint is above the

Re: lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Tue Sep 22 10:52:31 EDT 1998 | Wayne Bracy

| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material

Re: Dross/Oxide problems with wave soldering machine

Electronics Forum | Mon Jan 31 12:24:24 EST 2000 | Dave F

Robert: Several points: 1 Dross is a mixture of various things with no "fixed" composition: � The obvious things are metal oxides mixed with metal and this can vary in color with temperature and composition - remember some intermetallic oxides form

Re: lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Fri Sep 18 08:49:12 EDT 1998 | Earl Moon

| | We have problems with voids when we solder lids to | | ceramic flatpackages. | | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | | The solder is attached to the lid (preform) and the solder

Re: lid soldering problems (CQFP, Au/Sn solder)

Electronics Forum | Thu Sep 17 10:45:27 EDT 1998 | Justin Medernach

| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material


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