Electronics Forum | Tue Mar 07 08:48:55 EST 2006 | samir
Our ICT Guy here at my company loves to use lots of via holes as test points - via holes which are 0.040" diameter, and spaced at 0.004" edge to edge spacing! He doesn't like to tent the via's either, so I always battle via-to-via shorts at the wave
Electronics Forum | Fri Jul 30 14:16:11 EDT 2004 | C.W
For VIA In PAD design, what's the difference between a thru vias and a blind via? thanks' chester
Electronics Forum | Fri Jul 30 14:21:36 EDT 2004 | C.W
what's the difference between a thru vias and a blind via?
Electronics Forum | Fri Jul 30 16:41:14 EDT 2004 | Dave
Consider a 6 layer board. The Through via gets drilled from top layer to bottom layer. All 6 layers has the hole drilled in it. A blind via is a via that does not got through the entire 6 layers. It would go from layer 1 to layer 2. or layer 6 to lay
Electronics Forum | Mon Aug 02 11:49:02 EDT 2004 | jbabson1
Blind vias are just that. They do not show on the surface sides of the pwb.
Electronics Forum | Sat Jul 31 17:27:50 EDT 2004 | C.W
thanks! So, why via in pad design is implemented? what's the advantages of it?
Electronics Forum | Mon Aug 02 13:46:10 EDT 2004 | Bob R.
Via in pad lets your layout guy run traces on inner layers so there's more more area available on the outer layers for placing parts, test point, etc. There are also electrical advantages due to shortening paths, but I'm just a simple mechanical eng
Electronics Forum | Fri Jul 30 16:12:12 EDT 2004 | davef
Search for "SMT Terms and Definitions" in the "Library & Bookstore" tab in the light blue area on the left of your screen.
Electronics Forum | Tue Mar 03 02:39:56 EST 2015 | sarason
I would presume you reflow the top of the board first. Use tented vias. As you have worked out, vias have surface tension, which sucks the solder up the hole during reflow of the bottom of the board. Good luck! regards sarason
Electronics Forum | Tue Mar 03 03:11:57 EST 2015 | vb7007
Hi I also forgot to mention, top side is reflowed first at SMT. Tenting vias is good option. we are looking into it. Can you please also suggest any solution to avoid solder balls at bottom side in other places than vias. Thanks
