Electronics Forum: theres (Page 3 of 291)

SMT Equipment

Electronics Forum | Mon Jul 29 11:08:39 EDT 2002 | Rob Fischer

How about Kulicke and Soffa? They've been making their wire bonding equipment there for years and have finally decided to do all of their manufacturing there. I think we're all faced with the same concern and it is frustrating because there are ver

HASL for small pitch devices

Electronics Forum | Wed Nov 12 09:32:30 EST 2008 | markhoch

Are there better options? Dude, EVERYTHING else is a better option. Gluing aluminum foil down to the bare copper would be a better option. ENIG (Electroless Nickel Immersion Gold), Immersion Silver, Immersion Tin, and OSP all provide flatter surfac

SMT transformer misalignment

Electronics Forum | Sun May 02 11:36:27 EDT 2010 | jdeluna

I do agree with Jerry: you should apply more paste on it, either with a step stencil, or doing overprint on it by, let's say 120% on Transformer's pad. Also, you need to check : a) there's smooth movement on transport process after the placement, no

Headers and SMT

Electronics Forum | Mon Nov 02 14:45:25 EST 2015 | stevezeva

Hi there! If they are just standard headers there's a company called Teka that makes headers and socket headers with solder preforms in them. They call it "Solder Bearing Lead Technology" You can drop them in the board and reflow them just like SMT p

Package rebake

Electronics Forum | Wed Jan 09 01:22:39 EST 2019 | kenneth0

Hi Simond, The baking process is likely to remove any moisture after the cleaning process. We wouldn't want any moisture trapped as this might cause delamination if the package is subject to subsequent heating/reflow process. Hence there's a staging

Re: Contaminated Pads

Electronics Forum | Wed Sep 20 19:30:15 EDT 2000 | Dave F

Consider searching the SMTnet archives. There's 30+ postings for black and pads. Good luck.

Re: Capability Study for Solder Printing Process

Electronics Forum | Thu Sep 21 14:02:36 EDT 2000 | csullivan

I am interested in those papers, too. Any other help out there?

Re: Dbl-Sided Reflow Question

Electronics Forum | Tue Jun 06 20:10:28 EDT 2000 | Dave F

You bet. It goes liquidous and tries to flow down hill flux or not. * And wudda wanna bet there�s still flux residues in those vias, anyhoo? Yes, you're right!! There might be excess flux residues in them via barrels....but why

Re: Stacking chips

Electronics Forum | Tue May 16 05:45:46 EDT 2000 | Wolfgang Busko

Ashok: Couldn�t find that part in IPC-7711 either. I was just remembering that proposal from that thread mentioned. So you are still in that position I was at that time. Looking into IPC-D-275 (I have to admit that I have only an old issue in my offi

RFP

Electronics Forum | Tue Feb 06 10:10:26 EST 2001 | bcaler

Just curious what the RFP catagory stands for in Marketplace? I don't see anything in there. Brian


theres searches for Companies, Equipment, Machines, Suppliers & Information