Electronics Forum: thermal pad (Page 3 of 49)

Pallet absorb thermal heat : compensate by higher deg-C?

Electronics Forum | Sat Jun 09 09:32:26 EDT 2001 | davef

Yes, your pallet will absorb / steal heat. It sounds like you are doing a good job in understanding the issues. Yes, the pallet could be the problem. Is this a new run that you are starting? Or has everything been OK, but recently you've begun to

BGA ball and PCB pad

Electronics Forum | Fri Feb 27 11:33:32 EST 2004 | Bryan

Very strange question,but interesting.Is there anyone who have conducted any experiments to figure out the results?I made a profile board,one thermal couple on pad and other one drilled into the ball of BGA.the 2 points are perpendicular to conveyor

Thermal Relief BGA pad design traces

Electronics Forum | Mon Jun 02 16:33:35 EDT 2008 | operator

Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of

Reflow soldering lead onto much larger pad

Electronics Forum | Mon Dec 07 14:55:41 EST 2015 | clydestrum

So I have an issue coming up that I'm not too sure how to handle. A board was designed with the wrong footprint for a 3-lead transistor in which the single-lead side has a much larger (think thermal pad for qfn) copper land than what is meant for the

DPAK's sliding off pad during reflow

Electronics Forum | Thu Aug 13 14:10:01 EDT 2015 | markhoch

Hi Sam, I have a feeling that what you're trying to communicate is that your DPAK's are skewing off the pad during reflow. This is caused by a thermal "mismatch" where the solder paste on one side of the DPAK becomes molten before the other, then th

Voids in grounding pad of RF PCB

Electronics Forum | Fri Aug 02 12:07:50 EDT 2002 | johnw

Richard, your asking a multi million dollar question that in my own opinion no one can give you the right answer since no one really knows. hence I think the lack of answers to your question....thought there would be more people willing to propose a

Placement of 32 pin QFN w/t ground pad

Electronics Forum | Fri Oct 16 14:11:16 EDT 2009 | davef

thermal and pad

Placement of 32 pin QFN w/t ground pad

Electronics Forum | Wed Oct 21 08:06:06 EDT 2009 | scottp

I agree with Dave. If the device has a lot of power we'll put thermal vias between the solder deposits with annular rings of soldermask to keep solder out of the holes. We've never had to mess with placement pressure. We've been using QFNs for yea

Use of Linear Technologies LTC1733

Electronics Forum | Wed Jan 07 09:09:44 EST 2004 | russ

Her is how we rework these typew of components. First remove the device using hot air. It is sometimes helpful to heat the back of the board if possible to get the thermal pad heated with less strain on adjacent comps. Remove the remaining solder

Thermal Interface Materials

Electronics Forum | Wed Mar 10 12:02:07 EST 1999 | Craig Holloway

Looking for advice/products on ways to get heat out of a package and into an internal thermal plane. Will have electrically isolated thermal pads (going to an internal thermal plane) under the part. Need a way to get good thermal contact between par


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