Technical Library: thermal pad (Page 3 of 28)

Attaching Fiber Optic Modules

Technical Library | 2019-08-01 10:58:32.0

Optical fibers transmit information in the form of pulses of light. The advantages of optical fibers over traditional copper wires include: higher throughput, greater signal distance and speed, smaller cable mass and diameter, greater pull tension limit, and resistance to electromagnetic interference (EMI) and radio frequency interference(RFI). The disadvantages of fiber optics when compared to copper wires include: end-face defects, cleanliness, and the ease of attaching connectors to electronics assemblies (Figure 1).

ACI Technologies, Inc.

Manufacturing Cost Reduction through Automation

Technical Library | 2019-06-24 15:54:17.0

Defense systems and its manufacturers are often blamed for not embracing new and innovative technologies to manufacture products compared to its commercial counterparts. Commercial product manufacturers are known to think “outside the box” in coming up with new products which are cheaper, have fewer parts, and easier to manufacture using automation. Automation leads to consistent quality products which are reliable and reproducible. Implementing some of these producibility design practices into defense systems will greatly reduce the cost and insertion time for new products.

ACI Technologies, Inc.

Computer Aided Design, Manufacturing, and Engineering

Technical Library | 2019-07-01 10:44:11.0

In the electronics industry of today, companies emphasize better quality, lower cost, and shorter lead time on their products in order to keep up with their competitors. ACI Technologies (ACI) has been utilizing Computer Aided Design (CAD), Computer Aided Manufacturing(CAM), and Computer Aided Engineering (CAE) in its development of advanced electronics systems. CAD utilizes computer systems to assist in the creation, modification, analysis, and optimization of a design [1].

ACI Technologies, Inc.

Reliable Selective Soldering For High Volume Assemblies

Technical Library | 2020-04-14 16:00:20.0

The number of through hole connections on a circuit assembly are decreasing with the drive toward miniaturization. When these assemblies are manufactured in high volumes the most convenient method is selective soldering. Although selective soldering is very well introduced in automotive and industrial applications it can also be a very efficient method to solder high volume consumer products.

ITW EAE

Through-Hole Soldering Defects And The Solutions

Technical Library | 2020-03-01 23:06:45.0

For though hole soldering, no matter it's wave soldering or selective soldering, the process is same formed by fluxing,preheating,soldering. How these 3 process will change the soldering result? When you face the soldering defects, what could be the reasons caused these and how to debug them? With below information you may get some hints.

1 CLICK SMT TECHNOLOGY CO., Limited

Cleaning Flux Residue under Leadless Components using Objective Evidence to Determine Cleaning Performance

Technical Library | 2019-08-14 22:20:55.0

Cleanliness is a product of design, including component density, standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manufacturing process soil, such as flux residue, incompletely activated flux, incompletely cured solder masks, debris from handling and processing fixtures, and incomplete removal of cleaning fluids can hinder the functional lifetime of the product. Contaminates trapped under a component are more problematic to failure. Advanced test methods are needed to obtain "objective evidence" for removing flux residues under leadless components.Cleaning process performance is a function of cleaning capacity and defined cleanliness. Cleaning performance can be influenced by the PCB design, cleaning material, cleaning machine, reflow conditions and a wide range of process parameters.This research project is designed to study visual flux residues trapped under the bottom termination of leadless components. This paper will research a non-destructive visual method that can be used to study the cleanability of solder pastes, cleaning material effectiveness for the soil, cleaning machine effectiveness and process parameters needed to render a clean part.

KYZEN Corporation

StencilQuick™ Lead-Free Solder Paste Rework Study

Technical Library | 2007-01-31 15:17:04.0

The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.

BEST Inc.

BGA Thermal Shock Testing

Technical Library | 2007-02-01 09:27:47.0

The purpose of the testing was to compare the resistance and check for open circuit conditions of reworked BGA test samples made with and without StencilQuik™ after 500 thermal shock cycles. StencilQuick™ is a product of Best Inc. In this series of tests, the resistance of daisy chain resistance patterns running between the BGA and test board after exposure to thermal shock was measured.

BEST Inc.

Reballing a QFN Simplifies QFN Rework

Technical Library | 2014-09-11 11:36:46.0

There are a variety of methods one can use to rework QFNs. This paper explains one of the ways to get very little center ground voiding while making it easy to place a tiny component with almost no keep out areas.

BEST Inc.

Reliability of Reworked QFNs

Technical Library | 2014-09-11 11:43:48.0

In this DOD study the reliability of reworked QFNs is studied with the outcome being that a stay in place stencil does not impact the reliability of a QFN reworked using this technique

BEST Inc.


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