Electronics Forum | Tue Apr 10 04:16:20 EDT 2012 | grahamcooper22
you are seeing a typical issue that is caused when such small volumes of paste are printed....there are several reasons for it..the tiny amount of flux in the small deposit becomes exhausted much quicker then it does in a larger deposit ( the flux ma
Electronics Forum | Mon Jan 11 15:20:29 EST 1999 | Chrys
| I have an Electrovert UPK 660c fitted with IR preheats top and bottom. We assemble a large range of multilayer backplanes and I was wondering if there are any advantages in changing to convection preheats.Has anybody got any views on the subject.
Electronics Forum | Fri May 22 12:42:43 EDT 2015 | deanm
Sr. Tech, you are right in that there is no verification of the profile. We are a Class 3 high mix OEM. We have visual inspection after SMT. We have not seen problems with wetting, grainy solder, cold solder, charred boards, etc. that would indicate
Electronics Forum | Thu Dec 18 14:44:59 EST 1997 | Scott Cook
No problem..... > No; the last time I used the process was 1983. > Yes, and in your neck of the world, I'd bet you're looking at Flutec products.....(I used PP11 juice way back in 1979). > I would dispute this. I did EXTENSIVE testing for thermal eff
Electronics Forum | Tue Jan 12 15:11:20 EST 1999 | Earl Moon
| | I have an Electrovert UPK 660c fitted with IR preheats top and bottom. We assemble a large range of multilayer backplanes and I was wondering if there are any advantages in changing to convection preheats.Has anybody got any views on the subject.
Electronics Forum | Tue May 18 18:17:50 EDT 1999 | Scott Cook
| Looking at the full convection reflow oven market, I see two segments, high mass heater ovens (i.e. Electrovert Omniflow,...), and low mass heater ovens (i.e. Heller,...) | Did some of you guys did some testing on both types and what were your find
Electronics Forum | Thu Feb 13 03:49:15 EST 2014 | jlawson
Yes all above is correct, as solder deposits get smaller and mesh T4+ , actual metal to air contact surface area increases , say in contrast to T3, add to this less flux , and flux running away from the joint, re-oxidation and what flux is left, can
Electronics Forum | Wed Jun 03 22:07:41 EDT 2009 | davef
= 0.66 aperture opening to the stencil wall has been shown to provide the best transfer efficiency and repeatability of the deposited paste. Values from 0.66 to 0.8 insure a good paste release from the stencil. The biggest impact on area ratio is the
Electronics Forum | Mon Jan 23 22:53:31 EST 2012 | davef
= 0.66 aperture opening to the stencil wall has been shown to provide the best transfer efficiency and repeatability of the deposited paste. Values from 0.66 to 0.8 insure a good paste release from the stencil. The biggest impact on area ratio is the
Electronics Forum | Wed Dec 15 12:50:39 EST 2010 | hegemon
We evaluated Vapor Phase Reflow in 2010, and in the short time I experienced the machine, I came away with the following. The advantages you are (hopefully)already aware of, such as overall tranfer of heat to the PCB, no chance of temperature oversh
