Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Tue May 08 21:13:04 EDT 2001 | Paul
My company is a low-volume high mix contact electronic manufacturer. We are currently looking at purchasing a pick and place machine that is capable of mounting such new components as microBGA's and other CSP's at such ball pitches as 0.5mm for examp
Electronics Forum | Thu Jun 07 15:37:32 EDT 2001 | Claude_Couture
Kerryn, It's the first time I hear someone who needs an automated inspection machine to check the cleanliness of stencils. Why not improve on the cleaning method itself. I use ultrasonic batch cleaner. It takes 3 minutes to clean a stencil, 2 minutes
Electronics Forum | Wed Feb 09 12:31:54 EST 2005 | russ
We are not doing this right at the moment but I have done it with great success. Of cource it depends on your pad layout we have a 20 mil gap in between pads, we printed at 10 mil wide with a 5mil stencil. I will try to find the glue we used, I kno
Electronics Forum | Mon Apr 25 22:56:44 EDT 2005 | davef
rush316 First, no one stated that PBB and/or PCBE are in FR4. FR4 contain tetra-bromo-bisphenol A [TBBA]. Second, there are classes [and grades] of dielectric materials used in fabricating printed circuit boards. Grades, NEMA LI-1. From these gr
Electronics Forum | Thu Feb 26 14:47:19 EST 2015 | superlen
unique mnf/mnf part number. - Be meticulous on maintaining your WO Boms. Train your employees to not circumnavigate keeping the WOBOM accurate to what they kitted/placed on the board. If you keep the one to one part number relationship above this is
Electronics Forum | Fri Jul 28 14:34:13 EDT 2000 | Gary Simbulan
Belive it or not, these boards were run through a Centech batch mode Vapor Phase machine. Single stage top side IR preheat. Vapor temp 218 C. Solder paste is an SN62 RMA.The boards were FR4 8 layer w/ solder mask, fairly conventional as might be e
Electronics Forum | Wed Dec 02 15:36:58 EST 1998 | Alden Lewis
| We are in the process of assessing some medium volume, stand alone SMT Placement systems. Does anyone have any experience with :- | | 1) Europlacer (Specifically the Progress 6 or EP600) | 2) Intelliplace (DHM-120 or SHM-120) | | I have searched
Electronics Forum | Fri Oct 12 09:17:12 EDT 2001 | mikecampbell
Hello, I need some advice. I want to create apertures in my stencil for a IBM CCGA. I've heard the standard is 4800 cubic mils of paste per aperture. I usually use a 5mil stencil for this type of product. There is no way I'll get enough paste wit
Electronics Forum | Wed May 31 22:17:24 EDT 2006 | EC
Hi Jack, I do not know what type of machine you are using and how old is your machine. But I have this problem before using Fuji machine. There are few things cause part throw.....placment speed, feeder, pick up tolerance, part dimension tolerance,
