Electronics Forum: tube standard (Page 3 of 4)

Lead-Free alloy determination in repair / rework

Electronics Forum | Tue Mar 08 11:50:55 EST 2011 | pgoodyear

As a technician that does frequent board level repair / rework some issues have come to mind. I have been an electronics technician for almost 50 years. In that time I have seen the evolution of electronics from point to point wiring using vacuum

How to choose a new solder paste

Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp

Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux

Re: solder mask

Electronics Forum | Sun Aug 15 05:45:15 EDT 1999 | Brian

Boca, Dave Sorry, but I cannot let this go. I'll go along with you that, at the time that the Montreal Protocol was initially signed (September 1987), there was no scientific proof that CFCs etc. were causing ozone depletion. There was, however, ve

Share info for Six sigma - BB

Electronics Forum | Mon Mar 05 18:56:47 EST 2001 | davef

Stefan: Thanks for the clarification on the Siemens machine operation. Yes Stefan, Germany and some other countries have wonderful apprentice programs. Generally, we Americans have the patience of a staving gerbil for such things. Is the ON butto

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:16 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:55:28 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

Re: BGA Inspection Criteria

Electronics Forum | Sun Dec 10 11:56:05 EST 2000 | Bob Willis

The following may be of interest to you. INTRODUCTION TO X-RAY INSPECTION All text Copyright Bob Willis, EPS INTRODUCTION TO X-RAY INSPECTION The use of X-ray inspection is becoming very popular due to the increased use of Ball Grid Array (BGA)

What's The Waste?

Electronics Forum | Tue Feb 20 13:10:54 EST 2001 | billschreiber

Hello Dave, Before I get into waste management, I must first stress the importance of checking with your local regulating agencies. Every area can be and usually is different. California regulations differ from Ohio and Ohio�s are different than Mu

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

Re: Use of Wood on PCB Assembly Production floor ??

Electronics Forum | Thu Mar 09 16:56:19 EST 2000 | Dave F

Ashok: If I was to count, I'd guess there was more than 4 subquestions. Hey, but who's countin' anyway? I have answer (s) "on ESD all related to use of wood in a typical PCB Assembly line:" Before pushing-on, it is only "a typical PCB Assembly li


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