Electronics Forum: via hole tenting (Page 3 of 53)

Dealing with BGA solder ball in via hole

Electronics Forum | Thu Mar 24 15:58:52 EDT 2011 | davef

Just build-up the boards and ship them. Be sure to inform your customer about the problem that you have with their design and ask that the via be filled and plated over to prevent the problem in the production runs.

Dealing with BGA solder ball in via hole

Electronics Forum | Thu Mar 24 18:05:54 EDT 2011 | nkinar

That's really interesting, davef. How would I jumper the via to the pad? Could you elaborate?

Dealing with BGA solder ball in via hole

Electronics Forum | Thu Mar 24 16:06:34 EDT 2011 | nkinar

Thanks for the reply, davef. Due to prototyping time constraints, I've been asked by the engineers if I could do something on the SMT line to salvage this prototype PCB. Could I do anything to connect the pad or fill the via? Much of the board h

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Wed Jun 01 15:50:59 EDT 2011 | markhoch

I don't believe that particle size of the solderpaste will offer you any relief from this issue. The solder flows into the via, leeching away from the desired solderpoint, after the solder has become liquious. The chemical make-up of the solder contr

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Wed Jun 01 14:50:09 EDT 2011 | kahrpr

Try shifting the placement location slightly toward the pad that is not soldered. This is assuming it is always standing up on the same pad

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Thu Jun 02 06:23:08 EDT 2011 | alcatel

1 chip has 2 solder pads....and both pads definitely has solder.... im not getting what you are trying to say.

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Thu Jun 02 06:23:40 EDT 2011 | alcatel

1 chip has 2 solder pads....and both pads definitely has solder.... im not getting what you are trying to say.

Bigger particle size solder paste helps reduce via hole problem?

Electronics Forum | Thu Jun 02 10:54:12 EDT 2011 | davef

Al: We agree with AVFOM. You have a different problem than solder paste mesh selection. Most often, tombstoning occurs when the wetting forces on the two pads are unequal. Examples of things that can cause this are: * Pads are different * Board pad

HELP!! via sizes, location

Electronics Forum | Tue Oct 05 10:48:46 EDT 1999 | Frank Fossett

I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via's u

HELP!! via sizes location

Electronics Forum | Tue Oct 05 10:13:48 EDT 1999 | Frank Fossett

I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer wants to use an .035 pad with a .012 dia. hole, there are no via's under the zero clea


via hole tenting searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for handload Selective Soldering Needs

High Throughput Reflow Oven
One stop service for all SMT and PCB needs

Training online, at your facility, or at one of our worldwide training centers"
IPC Training & Certification - Blackfox

World's Best Reflow Oven Customizable for Unique Applications
Voidless Reflow Soldering

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Fully Automatic BGA Rework Station

"Heller Korea"