Electronics Forum | Tue Mar 22 20:33:24 EST 2005 | davef
Q1. What are you guys doing for filled/tented/plugged vias on the BGA site? A2. 2221A, 4.5.1 tells you the vias have to be tented on both sides. Q2. What type of issues can this cause if using no filled/tented/plugged vias on the BGA site? A2. BGA
Electronics Forum | Tue Aug 18 10:18:22 EDT 1998 | Dave Hulbert
I have a question on tenting of vias on PWB's. I have designed a 6 >layer, military, mixed components (all on top side), LPI soldermask >board which will be run over the wave. I was planning on tenting vias >but did not specifically specify that on f
Electronics Forum | Mon Aug 31 14:03:41 EDT 1998 | Bill Childs
I have a question on tenting of vias on PWB's. I have designed a 6 | >layer, military, mixed components (all on top side), LPI soldermask | >board which will be run over the wave. I was planning on tenting vias | >but did not specifically specify tha
Electronics Forum | Wed Mar 23 22:28:10 EST 2005 | KEN
I ran into this yesterday. Seems some designer decided to not solder resist the via's on the solder side. Then the assembly went over the wave solder in a universal fixture. Not an ideal situation.
Electronics Forum | Thu Feb 07 11:59:48 EST 2002 | Ron Costa
When double sided BGA's are used on an .062 FR4 10 layer board should via's be plugged and tented? The CACHE chips being used are PBGA's 1.27mm pitch. The pad size is .030 and the finished via dia. is .010. This is a dogbone type pad and via design.
Electronics Forum | Thu Aug 25 10:17:48 EDT 2005 | davef
Send the pic to dave5252 at hotmail.com [you can't send pic through the SMTnet email thing] For more on via plugging, tenting, capping ... look here: http://www.merix.com/technology.php?section=processes&page=pdf/Via_Fill_Plug.pdf Something, a voi
Electronics Forum | Tue Jan 31 15:44:08 EST 2006 | John S.
We're looking at lead free surface finishes for some of our products. On one supplier's site, I found a note that tenting vias on ENIG boards can lead to the black pad phenomenon. How does this compare to your design guidelines and experience? Than
Electronics Forum | Wed Feb 01 14:31:03 EST 2006 | John S.
http://www.saturnelectronics.com/docs/Getting_the_Lead_Out.pdf This is a document provided by one of our suppliers discussing lead free PCB considerations. Within the document, it mentions black pad being associated with tented vias. Thanks John S.
Electronics Forum | Fri Jun 09 17:34:08 EDT 2000 | Melanie Mulcahy
I need some information regarding the acceptability/unacceptability of using tented vias with LPI soldermask. Long story on all involved, but basically I have a board that I have had manufactured with no problems which has BGA/uBGA parts, tented via
Electronics Forum | Sun Jan 09 19:37:15 EST 2005 | Bob R.
I'm just thinking out loud here with no experience to back it up, but I could see where you're trapping air or solvent filled voids inside the via by tenting from both sides. When you go through a heat cycle like reflow or wave solder you could be e
