Electronics Forum | Thu Feb 21 04:41:37 EST 2008 | mun4o
hi,Toni, we use only FR4.Some of PCB we order in China and Taiwan.With these PCBs we can't any problem.Other PCB we order here in Bulgaria.The problems with voids start last year - we have voids only in PCBs from Bulgarian factory.The process is sam
Electronics Forum | Wed Feb 28 19:44:50 EST 2001 | pzohbon
I am having problems with voids in our soldering process. I believe it to be the fact that we use a no clean flux without control on how the boards are handled (gloves, procedures, etc.) Does anyone have suggestions on the appropriate place to start?
Electronics Forum | Thu Mar 01 11:43:08 EST 2001 | dason_c
Not enough info, when you say no clean flux, is it for wave soldering process, please provide more detail, SMT or wave, is it all the joint which you find the void? Rgds
Electronics Forum | Mon Sep 28 12:55:37 EDT 1998 | Manish Ranjan
Hi Everyone Does anyone has any insight regarding the void formation in the solderbumps during wafer bumping by electroplating. Someone told me that it could be mainly coz of the alloy concentration being incorrect. Any suggestions, corrective action
Electronics Forum | Thu Apr 17 13:02:28 EDT 2003 | Takfire
Thanks Dave! What level of voiding is acceptable? Would you please let me know if there is an EIA or other industry standard detailing solder joint quality? I will begin researching the background information you provided. Thanks again for your kin
Electronics Forum | Wed May 06 04:31:42 EDT 2009 | radzi
We have prob Solder voids for Connector, Micro D. We used HMP solder wire and pcb thickness is 0.093".
Electronics Forum | Wed Apr 16 13:19:13 EDT 2003 | Takfire
Thanks Russ! The origianal complaint from the customer was in regards to what appeared as "bumpy" appearance and "holes" in the solder fillet. This problem was originally presented as an appearance issue only. Further investigation by our DPA lab r
Electronics Forum | Mon May 05 11:48:33 EDT 2003 | mk
We have had good luck with via in pads using solid solder deposition. Please contact me off line or provide a number I can call. Thanks Matt Kehoe m.j.kehoe@att.net
Electronics Forum | Mon Nov 11 10:29:37 EST 2002 | Yannick
Hi, I'm beginnig working with BGA and with test I made I see some Void in it. I know that IPc have something on it. But I would appreciate if someone who have a good knowkledge about it contact me at: yb@m2s.ca Or can you give me some hint t
Electronics Forum | Wed Apr 16 10:45:16 EDT 2003 | Takfire
Recent cross-section analysis for a customer complaint revealed voiding in the solder fillet. In some cases, the remains of outgassing were also observed. During the failure analysis, we also observed failures where the solder fillet wicked on the
