Electronics Forum | Wed Nov 21 06:07:20 EST 2018 | robl
Hi Prem, Voiding has lots of causes, but boiling off flux to quickly really doesn't help, so maybe a more gentle profile. Also you do not need to print a solid block of paste, you can print a window pain style pad to help the flux escape. Also, th
Electronics Forum | Fri Nov 23 05:59:18 EST 2018 | premkumar_haribabu
Hi RObl, Thanks for response , sorry to ask again & again . Is cobar paste solved the issues from poor wetting from nickel to PCB soldering,whether it will improve the peel off strenth more than 5 kg ?? as per our current last production , this nic
Electronics Forum | Mon Nov 26 13:40:40 EST 2018 | robl
Hi Prem, Yes, the flux in the Cobar paste helped with wetting and joint strength, as does reducing voids as there is more solder in the joint, as does cooling rate. Regarding peel test in KG, it depends on the pad size and volume of solder in the j
Electronics Forum | Fri Nov 16 03:38:03 EST 2018 | premkumar_haribabu
Hi all, We have to solder a nickel tabs ( coming in SMT reels ) in to HASL PCB finish pads using refow oven & during this we facing poor wetting issues, more voids & we done pull strenth , its came out with in 1 kg ,I doubt that nickel coated materi
Electronics Forum | Fri Apr 07 11:19:55 EDT 2006 | muse95
Technically speaking, most likely yes it will work, unless possibly it is a BGA. There are issues surrounding BGA's. Here are some of the general issues: On any type of component, if the Pbfree solder you are using contains bismuth, then the Pb in
Electronics Forum | Fri Jun 16 11:37:15 EDT 2006 | docker
I�m working in Solder paste manufacturing industry and my customer has complained the void issue on BGA pad. I�m internally conducting the void test on BGA pad in my Lab. I used OSP furnish board with Sn/Pb and /or lead free component using Lead free
Electronics Forum | Thu May 25 17:18:45 EDT 2000 | Boca
I have not done pin in paste in production quantites, but speculation is always a blast so; OA fluxes are active at room temperature, they grow 'fur' with humidity if not washed off, great stuff for soldering, nasty stuff for reliability (if not rem
Electronics Forum | Tue Nov 20 12:48:40 EST 2001 | tony_sauve
We recently experienced a problem w/voids (up to 65%) in uBGA solder joints. The only joints that have the problem correlated to pads which had blind 0.006" via's in them. The via's only extend down 2 layers, of the 18. 21 BGA's on the PCB, only expe
Electronics Forum | Wed Apr 16 11:20:31 EDT 2003 | russ
What was the original complaint? when you say solder wicked onto top of capacitor do you mean it was dewetted from the board and only on the cap? What type of device showed voiding? how bad was it 20%,50%? I have found that the paste type seems to
Electronics Forum | Thu Apr 17 10:38:02 EDT 2003 | davef
While Russ is correct that a little voiding is OK, your level of voiding [customer complains that the solder surface looks bumpy] doesn't give us the ol' warm and fuzzy about their process control. For background: * Search the fine SMTnet Archives.