Electronics Forum: warp baking (Page 3 of 6)

Re: T sub g

Electronics Forum | Thu Jun 25 14:41:07 EDT 1998 | Earl Moon

| Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Handb

SMT Connectors with locating pins

Electronics Forum | Tue Oct 30 18:43:31 EST 2001 | mparker

My first thought is board warp. This is something you can't see when the board is in a reflow oven. I see it occasionally going through wave solder. You may need a pallet with hold down clamps for reflow. Try putting a bare board in a baking oven at

BGA failure at Functional Test

Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70

Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f

Warp PCBA- how to repair

Electronics Forum | Sun Jul 15 20:10:09 EDT 2001 | Danial

What is the best method to repair Warped PCBA. Obviuosly twisting it back to make it flat would be a disasterous. The method that I've tried wold be mounting the assembled board to the flat holder with the clamp and bake them at 120 Deg C for about 4

MSL | Baking components after expired floor life

Electronics Forum | Mon Sep 12 20:24:26 EDT 2022 | stephendo

I'll answer the easy part. If you put low temperature trays in the oven at 120C, they will warp and partially melt. I have seen it more often with reels of LEDs. Someone is told to bake them before use so the put them in the batch oven and the next

Reducing Warp after reflow

Electronics Forum | Wed Oct 19 14:15:43 EDT 2022 | proy

Thank you all a but the easy fix - of correcting copper - is not an option -actually no changes to the board can be done simply they way it is.... I will look at post reflow bake above TG but I don't want to add a process.... Will look at profile als

Boards getting

Electronics Forum | Fri Aug 12 22:10:24 EDT 2005 | Mika

I agree with all the prior postings! But I have some additional thoughts about this. If there is a build up of moistures (% humidity) inside the pcb; before you reflow the pcba; then you will have the result out of the oven, just as you described. My

BGA Corner

Electronics Forum | Mon Jun 13 07:20:10 EDT 2011 | scottp

It's more likely the warp is due to material issues. I've spent way more time than I'd care to admit running Thermoire with various profiles and there's pretty much nothing you can do to reduce warp via profile unless your current profile is truly a

PCB Warp Issues

Electronics Forum | Fri Jul 16 17:39:33 EDT 2010 | deanm

It is a PCB design issue where the copper patterns are not balanced among the layers. Baking the boards in order to correct the warpage will not improve it. We've had a problem with one bare board in particular warping the same way from two differen

Re: T sub g

Electronics Forum | Fri Jun 26 11:27:12 EDT 1998 | Earl Moon

| | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Han


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