Full Site - : wetted (Page 3 of 353)

DEK Horizon 03iX SMT Printer

DEK Horizon 03iX SMT Printer

Used SMT Equipment | Screen Printers

DEK Horizon 03iX SMT Printer Model Horizon 03iX Operating System Win XP+09sp13 or up  PCB support Tooling  Magnetic tooling pins Camera type Hawkeye 750 or Hawkeye 1700 (optional) 198040 198043 hawkeye Board foil clamp siz

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DEK ASM E BY Stencil Printer

DEK ASM E BY Stencil Printer

Used SMT Equipment | Screen Printers

2.0 Cmk @ ± 12.5 μm (± 6 sigma) System alignment capability  > 2.0 Cmk @ ± 25 μm (± 6 sigma) Optimum core cycle time 8 seconds Substrate size 50 mm (X) x 40.5 mm (Y) to 620 mm (X) x 508.5 mm (Y) Operating System Windows 7 Embe

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Automatic solder paste printer GKg G9+

Automatic solder paste printer GKg G9+

New Equipment | Assembly Services

G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function

KingFei SMT Tech

Reflow Experiment

Technical Library | 2019-06-11 09:36:13.0

An experiment was recently performed ACI Technologies for a customer that was interested in comparing the wetting of lead-free solders with varying temperature profiles and atmospheric conditions. In order to deliver an objective measurement of solder wetting (in addition to subjective inspection analysis), a simple wetting indicator pattern was added to the solder stencil in an area on the test vehicle that had exposed and unused copper.

ACI Technologies, Inc.

DEK 265 GSX Screen Printer

DEK 265 GSX Screen Printer

Used SMT Equipment | Screen Printers

Input Power:  120VAC Features: Silver Camera, Understencil Wipe(dry, wet, or vacuum) , 29”x29” Stencil, Edge Clamp, set of squeeges with blades Soft Copy of User Manual, Technical Manuals and Diagrams Complete and Operational 30 Day Parts Excha

Lewis & Clark

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

ASYMTEK Products | Nordson Electronics Solutions

Ekra E4

Ekra E4

Used SMT Equipment | Screen Printers

Ekra Model Number: E4 Year: 2000 Type: Fully Automatic In-Line Stencil Printer Windows O/S Stencil Frame Size: 29 x 29 2.5D Inspection Pressure Controlled Print Head Top PCB Register + Edge Clamp Under Stencil Wipe

1st Place Machinery Inc.

DEK NeoHorizon 03iX

DEK NeoHorizon 03iX

Used SMT Equipment | Assembly Accessories

DEK NeoHorizon 03 iX: Machine Alignment Capability: ±12.5 µm @ 2.0 Cmk, (±6 Sigma) System Alignment Capability: +/- 20μm @ 2.0 Cmk, (±6 Sigma) Wet Print Capability: ±25 µm @ 2.0 Cpk, (±6 Sigma) - Certified by external system for every printer before

Qinyi Electronics Co.,Ltd

DEK NEOHORIZON 03iX

DEK NEOHORIZON 03iX

Used SMT Equipment | Screen Printers

Windows 10 Software Machine Alignment Capability: ±12.5 µm @ 2.0 Cmk, (±6 Sigma) System Alignment Capability: +/- 20μm @ 2.0 Cmk, (±6 Sigma) Wet Print Capability: ±25 µm @ 2.0 Cpk, (±6 Sigma) - Cer

SMTUNION

Juki SMT MACHINE SPARE PARTS SMT Nozzle JUKI RS-1 NOZZLE ASSEMBLY 7505 40183425

Juki SMT MACHINE SPARE PARTS SMT Nozzle JUKI RS-1 NOZZLE ASSEMBLY 7505 40183425

Parts & Supplies | Assembly Accessories

SMT MACHINE SPARE PARTS JUKI RS-1 NOZZLE ASSEMBLY 7505 40183425 JUKI Nozzle Specifications: Brand Name JUKI RS-1 NOZZLE Part Number 40183425 Model JUKI NOZZLE 7502 7503 7504 7505 7506 Ensure Test in machine confirmation Guarantee 1 month

KingFei SMT Tech


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