Electronics Forum | Fri Mar 17 19:54:46 EDT 2023 | onegrimeyczar
Thank you all for the quick responses!
Electronics Forum | Thu Mar 14 09:21:38 EST 2002 | davef
You should be looking for a better method of depaneling your boards. Listen. If you breaking components, it's not the component. It's you. Either you are: * Applying too much force. * Bending the board too much. * Locating the components too clos
Electronics Forum | Tue Jun 10 11:44:25 EDT 2014 | patel_daxa29
It is very hard to say by looking at picture(solder joint quality).Overall appearance looks good.If you think is not sufficient solder or meeting required standard, enlarge opening of connector on solder stencil. Make all conn. aperture square or in
Electronics Forum | Thu Mar 14 09:07:26 EST 2002 | cfraser
I can not tell you what the actual stress limits are. I can tell you that de-paneling PCB's by hand is a very poor choice. I have seen numerous accounts of cracked caps, resistors, and LED�s due to incorrect de-paneling procedures. I would recommend
Electronics Forum | Fri Jul 19 22:32:59 EDT 2002 | lysik
I am the first to bitch about OEM's. So I will tell you this. I ordered a part from Universal instruments that was made in 1979. They were happy to tell me it was in stock and they would ship it over night. That is the BALLS. not only did they have i
Electronics Forum | Thu Jun 12 17:52:37 EDT 2014 | jorge_quijano
Update 6/12 After solder preform (SAC303 0603) I did not get good result... Couple of connectors have a guide pin that does not allow enough space for preform :( I will try with aperture size modification for my next run. What about step up stenci
Electronics Forum | Fri Jan 25 19:01:35 EST 2013 | hegemon
My first guess is that the plating in the barrel (via) has failed and allowed laminate/epoxy egress into the barrel and out to the surface of the board. Just a guess based on the picture.... 'hege
Electronics Forum | Tue Jun 10 11:42:01 EDT 2014 | rway
Your bottom-side joints look deficient in solder. It appears that less than 50% of the land area is soldered.
Electronics Forum | Sun Nov 09 11:44:57 EST 2014 | robertwillis
Just thought it may be helpful, my FREE 100 page ebook on Pin In Hole Intrusive reflow is available to download see http://pihrtechnology.com/ Also my book on Package on Package may also be useful for the future see http://www.packageonpackagebook.c
Electronics Forum | Mon Nov 10 09:29:30 EST 2014 | jorge_quijano
Hola Bob, in fact I made the proposal for the PIHR just after review your e-book, it helped a lot! Gracias!
