Electronics Forum | Mon Jan 26 11:46:16 EST 1998 | Rin Or
| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct
Electronics Forum | Mon Feb 03 11:17:55 EST 2003 | Randy Villeneuve
White residues are a common problem when cleaning no-clean fluxe residues. The white residue forms when the flux residue is partialy removed, etc. Alcohol should not be your only solution for cleaning. In general, solvents may attack some plastic par
Electronics Forum | Sun Jan 26 22:28:46 EST 2003 | iman
we had a project like this once. switched to using "genosolve" chemistry (US source, expensive) in conjunction with a degreaser machine, works fine if you can spend the money.
Electronics Forum | Mon Jan 27 12:02:00 EST 2003 | Mike Konrad
Dave is correct. No-clean flux + water = white residue (unless the proper chemical is mixed with the water). Additionally, no-clean flux + IPA = white residue. Many saponifiers work well as do other cleaning agents. White residue may also be a re
Electronics Forum | Sat Jan 25 20:17:40 EST 2003 | ramanandkini
We are soldering a 8 pin TTL chip on to a CEM1 board that has a hot air level soldering. We use no clean soler paste for the reflow process. Now the customer wants us to clean since he is afraid of flux attracting the dust. We have some SMT LEDs that
Electronics Forum | Sun Jan 26 09:32:55 EST 2003 | davef
But soon after cleaning and drying with IPA, we find a white residue formation. A: IPA will not nothing to clean your board. The white residue is exactly what you should expect. Search the fine SMTnet Archives for background. >How do we avoid th
Electronics Forum | Fri Apr 03 19:04:02 EST 1998 | Steve Gregory
Hi Jacqueline! The dreaded white residue huh? YUCK! This seems to be a ongoing issue...probably because there are many different things that can possibly cause this. There's a real good article about the different causes of this problem at Kest
Electronics Forum | Mon Oct 30 21:00:31 EST 2006 | hanocete
thanks for your inputs,but what i meant was that a connector component beside the BGA for repair has some flux residue on its leads after baking, the BGA was Ok. we are wondering why this happened...pls enlightened us.
Electronics Forum | Thu Nov 09 05:21:38 EST 2006 | jnaligan
hams, whats the result?
Electronics Forum | Tue Oct 31 01:32:47 EST 2006 | hanocete
thanks for your reply, actually we bake the PCB assembly prior the rework because the package was exposed for quite some time already. The baking time was 24hrs @ 125 deg.C. We notice that there were flux residues on the connectors after the baking.
