Electronics Forum | Sat May 24 00:43:59 EDT 2003 | iman
Our engineers did a study on our medical product with 1mils standoff height, and one issue was 100% of the boards that underwent ultrasonic failed due to failure of the package wirebonding. Poor reflow control would be one area to review in any event
Electronics Forum | Fri Oct 30 09:19:46 EDT 2009 | cab
We have performed some EDS analysis and found high percent (approx 18% ) of Ni on surface of gold pad. Found Tungsten as well. This is an HTCC alumina package. Thickness of gold was confirmed and found to be in spec. We believe we are dealing wi
Electronics Forum | Mon Sep 09 15:38:02 EDT 2013 | arendonk
Hi, We are having issues aluminum wirebonding on ENEPIG plated PCB by a too low pull force and or having lifts (1% range). Could any body advice how to solve this problem? Is there a special wire bond grade required? How to best clean contaminant
Electronics Forum | Wed Jan 22 10:24:23 EST 2014 | cyber_wolf
No matter how good your process is, you will get solder on the gold fingers/lands unless they are protected. We have proven that solder will get on the gold fingers in the reflow oven. How that happens....we arent't 100% sure...there are a lot of the
Electronics Forum | Wed Mar 17 21:42:19 EST 1999 | Chuck Garth
We are presently aluminum wirebonding to gold plated lands. Our board manufacturer has been very inconsistient in the quality. It seems as though theey are over etched by about half the amount they should be. Can anyone give me the spec's that normal
Electronics Forum | Tue Jun 04 19:15:15 EDT 2002 | rob_thomas
Por, Why do you clean no-clean flux residue?I didn't use the product you mentioned but I got some help from the folks at Cookson group last year when I did wirebonding after no-clean smt processing.check their website.Check your profile as well.unles
Electronics Forum | Sun Mar 02 12:16:29 EST 2003 | ramanandkini
Recently, one of our new vendor supplied us PCBs with Electroplated Nickel and Gold. We have the other regular source giving us ENIG plating. In both the wirebonding quality is OK. How do we benchmark this? Which one is suitable for production with l
Electronics Forum | Mon May 05 19:45:39 EDT 2008 | hegemon
Yep, many of us have seen this firsthand. I had a customer who fouled up a job, then "found" a deal on some (10) very expensive Xylinx parts, and badly needed these parts to complete the job. Everything looked good afterwards, but nothing worked. X
Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong
Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c
Electronics Forum | Sat Oct 31 01:22:35 EDT 2009 | mysmt
We have performed some EDS analysis and found > high percent (approx 18% ) of Ni on surface of > gold pad. Found Tungsten as well. This is an > HTCC alumina package. Thickness of gold was > confirmed and found to be in spec. We believe > we
