Electronics Forum | Tue Nov 08 16:56:23 EST 2005 | Erik
Being a mostly-government contract house, we bought an XRF for R/I to inspect for the PRESENCE of lead in components. No matter which brand you get, they are all easy to use and relatively fast. We were very impressed with the software capabilities
Electronics Forum | Mon Apr 24 15:44:48 EDT 2006 | andersg1
Slaine, We are looking at XRF for RoHS due diligence. . . We have looked at a couple of hand-held, but wonder if they will get us where we need to be. . . are looking at benchtops. Would you be willing to contact me off-line regarding what you ha
Electronics Forum | Mon Jan 30 07:08:06 EST 2006 | Rob.
True, we weren't just checking for lead at the test lab we were also checking for banned substances in the plastics - PBB's & PBDE's which apparently appear a lot in the recycled plastics used in manufacturing connector bodies; & also the other banne
Electronics Forum | Fri Oct 05 18:16:20 EDT 2007 | bigdaddysoy9
Thanks for the replies. We have been doing the same thing. There's green everywhere and I'm getting sick of that color. I like Hussman's idea but most of our operators are pretty kinky and they would probably enjoy being beaten with a big stick. Anyb
Electronics Forum | Wed Jul 23 05:26:23 EDT 2008 | aj
Hi all, Thanks for all the replies. I got some XRF carried out on the boards ( ENIG) and they measure 0.03-0.04 microns of gold thickness. Boards that we have had no problems with measure 0.07-0.1microns. This looks like the main contributor alon
Electronics Forum | Fri Jul 11 08:17:22 EDT 2008 | aj
Hi Dave, Yes that is correct. I had a XRF carried out on some boards that I am having solderability issues on and the report came back with 0.04um - 0.05um as the measured gold thickness. Previous batches that went through fine measured 0.07-0.11u
Electronics Forum | Tue Sep 02 16:07:04 EDT 2008 | blnorman
Colorization is relatively uniform across the board. "Processing" is first pass reflow. I belive MacDermid is the ImmAg supplier. Plating thickness has not been determined, our XRF is being revitalized. Elemental analysis did show a large copper
Electronics Forum | Tue Sep 02 22:08:34 EDT 2008 | davef
MacDermid Sterling seems to take-on a brownish tint in high dew points. Look at figure 3, p14 here: http://www.enthone.com/docs/CircuiTreeNov2006ImAgStudy.pdf We not so sure that it's fatal. That you see Cu makes us nervous. Since your XRF is doin
Electronics Forum | Thu Apr 02 14:58:49 EDT 2009 | vladig
Hi Peter, Have the plating thickness checked with XRF. If the layer of Au too thin, then Ni can diffuse all the way through it during the first run and the surface won't be perfectly solderable for the second side. it might also have a thin layer of
Electronics Forum | Mon Oct 27 20:01:00 EDT 2014 | rangarajd
Hello, We are facing solderability issues on a particular lot of board. THe Nickel thickness measured with an XRF is around 400 U inches. Spec calls out for 130 u inches Nickel and 3 - 5 U inches gold over it. Assuming there is no porosity on the g
