Electronics Forum | Mon Jun 27 14:20:57 EDT 2005 | Bob R.
If you visually inspect the solder joints of the first dozen or so boards with the Pb free parts and you're meeting workmanship standards then I wouldn't worry about it. When we started getting the first barrage of Pb free parts a couple years ago w
Electronics Forum | Fri Jul 01 18:00:44 EDT 2005 | mrduckmann2000
RB, We have a gold finger problem here at our plant. Our kapton tape came off in the wave process and now we have 8 PCB's that have silver fingers. We are waiting on our new A.P.E. SRS-069 Gold Finger Plater. This mircle machine is going to fix a
Electronics Forum | Tue Jul 19 12:12:02 EDT 2005 | chunks
I have a QFP 160 used on 9 different products that had high fall out for "Insufficient Solder". Basically, a leg or two would pop free when inspected occasionally. This same part is used on different size products, located at different area of each
Electronics Forum | Fri Oct 14 09:58:13 EDT 2005 | patrickbruneel
Here's what I believe is happening. The main difference between the HASL boards and the gold plated boards is that HASL boards are pre-soldered. HASL boards need very little flux activity to get good hole fill and the machine settings have a wide pro
Electronics Forum | Wed Nov 09 11:01:41 EST 2005 | DannyJ
Hi Red and Greg, First, to Avalancher, the service that is mentioned is fantastic. I have used it various times with various connectors and headers with fantastic results. Just contact MyData and they'll tell you what they need. It's usually 5-1
Electronics Forum | Tue Nov 22 21:08:45 EST 2005 | davef
CMI International says, there are five basic, non-destructive methods of determining coating thickness. Each method was devised to achieve cost-effective, accurate, and repeatable results. Those methods are: * X-Ray fluorescence * Eddy-current * M
Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris
The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi
Electronics Forum | Wed Feb 22 17:25:22 EST 2006 | darby
Tricky question. 1. If you are using fiducials on the snap-off areas then try and have the tab adjacent to these. 2. In many instances your tab locations will be determined by the case in which you are fitting the PCB. You don't want to be filing dow
Electronics Forum | Fri Feb 24 13:04:17 EST 2006 | patrickbruneel
Hi All, The change over to lead-free is as easy or as difficult as you want to make it The big problem I see with this lead-free transition is that there is no benchmark of acceptability and no defect data (yet) related to visual appearance of a sol
Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef
Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio
