Electronics Forum | Tue Jul 19 12:12:02 EDT 2005 | chunks
I have a QFP 160 used on 9 different products that had high fall out for "Insufficient Solder". Basically, a leg or two would pop free when inspected occasionally. This same part is used on different size products, located at different area of each
Electronics Forum | Fri Oct 14 09:58:13 EDT 2005 | patrickbruneel
Here's what I believe is happening. The main difference between the HASL boards and the gold plated boards is that HASL boards are pre-soldered. HASL boards need very little flux activity to get good hole fill and the machine settings have a wide pro
Electronics Forum | Wed Nov 09 11:01:41 EST 2005 | DannyJ
Hi Red and Greg, First, to Avalancher, the service that is mentioned is fantastic. I have used it various times with various connectors and headers with fantastic results. Just contact MyData and they'll tell you what they need. It's usually 5-1
Electronics Forum | Tue Nov 22 21:08:45 EST 2005 | davef
CMI International says, there are five basic, non-destructive methods of determining coating thickness. Each method was devised to achieve cost-effective, accurate, and repeatable results. Those methods are: * X-Ray fluorescence * Eddy-current * M
Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris
The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi
Electronics Forum | Wed Feb 22 17:25:22 EST 2006 | darby
Tricky question. 1. If you are using fiducials on the snap-off areas then try and have the tab adjacent to these. 2. In many instances your tab locations will be determined by the case in which you are fitting the PCB. You don't want to be filing dow
Electronics Forum | Fri Feb 24 13:04:17 EST 2006 | patrickbruneel
Hi All, The change over to lead-free is as easy or as difficult as you want to make it The big problem I see with this lead-free transition is that there is no benchmark of acceptability and no defect data (yet) related to visual appearance of a sol
Electronics Forum | Tue Mar 28 08:29:04 EST 2006 | davef
Pad design - Standard IPC 20 pitch QFP Thermal pad design - Layout the thermal pad 0mm to 0.15mm larger per side (0mm to 0.30mm larger overall) than the exposed die pad on the package. �Larger than�, as opposed to the same size, is preferred. Obvio
Electronics Forum | Fri Apr 07 11:19:55 EDT 2006 | muse95
Technically speaking, most likely yes it will work, unless possibly it is a BGA. There are issues surrounding BGA's. Here are some of the general issues: On any type of component, if the Pbfree solder you are using contains bismuth, then the Pb in
Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir
Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent
