Electronics Forum | Thu Sep 04 09:18:10 EDT 2008 | realchunks
In the REAL world most people don't have time to send out problem boards and wait for someone else to do their work. In the real world most of these problems on this forum are caused by someone doing something dumb, or a change was made that the pos
Electronics Forum | Wed Dec 10 08:30:20 EST 2008 | rgduval
Are you using no-clean solder, or just no clean flux? If you're using a solder with WS flux in the core, and a no-clean flux; we'd suggest switching to a WS flux to help during the soldering. If you are using a no-clean solder/flux combination, you
Electronics Forum | Mon Dec 15 16:16:42 EST 2008 | davef
J-STD-001 requires that solderable surfaces of components and connectors be degolded prior to soldering. As proven methods for removal of the gold plating and replacing it with tin/lead, MIL-STD-2000 and J-STD-001 endorse[d] either: * Double dip (two
Electronics Forum | Mon Mar 02 04:20:27 EST 2009 | emmanueldavid
Glossy/Matte & Plating). 2. Select Solder Paste according to Your Customer or In-House Specifications which is compatible for expected Process. 3. Use Chemical Etch / Electro Polished Stencil with proper Aspect Ratios (AR=>1.5) & Area Ratios(ArR=>0.6
Electronics Forum | Tue Feb 17 15:24:17 EST 2009 | glynnhamer
I know this is going to sound rather sad, but we have been using a Capton tape for years that contains silicone to mask large components as they go over the wave, as well as large plated holes on the pcb. It was handed down for years as accepted prac
Electronics Forum | Fri May 29 08:25:13 EDT 2009 | floydf
We are getting what looks like cold solder joints on one of our boards. The boards have an aluminum substrate, and use OSP plating. The solder is lead free - 96.5 Sn, 3.0 Ag, .5 Cu. The flux is no clean. When we first had the problem, my solder profi
Electronics Forum | Tue Nov 03 20:00:47 EST 2009 | davef
Solder Mask Adhesion Pull Test Tape List IPC-TM-650 Test Method 2.4.28.1, Adhesion, Solder Resist (Mask), Tape Test Method, defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated
Electronics Forum | Mon Nov 09 07:21:02 EST 2009 | CL
Good Morning, I have seen many posts regarding BGA voiding being excessive and what can be done to better the condition. I have a customer that has an assembly that we have had a diufficult time with. We have spent a lot of time debugging the proces
Electronics Forum | Fri Apr 23 17:59:54 EDT 2010 | hegemon
Therein lies the issue. Unknown storage conditions before we received the PCBs, date codes just expired (2 weeks), first article is de-lam city! Had a bad feeling about it. Have read some studies showing that there is no linear tie in of visual cha
Electronics Forum | Tue Jul 06 08:48:11 EDT 2010 | Sean
Hi all, Is anyone used to encounter PTH(plated through hole) crystal component(Not SMT component) become malfunction when the environment humidity is more than 90%? It is happening here...It is very weird that crystal become OK when humidity is bac
