Electronics Forum: stencil (Page 237 of 572)

Solder dust

Electronics Forum | Tue Mar 08 09:56:05 EST 2005 | caldon

Tim- You have two separate issues 1) Stencils and 2) wave. Stencils you can purchase a ultrasonic system that will remove the paste automatically or you can use stencil wipes to remove it manually. I would refrain from using towels and IPA as it dilu

DEK underscreen cleaning

Electronics Forum | Thu Apr 14 06:54:02 EDT 2005 | teera

hi! below are the item need to check: 1)top plate condition(under screen squeegee). 2)under screen clean contact position(with stencil) 3)make sure the thickness of wiper paper not so thick(not over 6o gm)becaue it will effect the vacuum suction. 4)s

Problems with .45 mil ball diameter BGA....

Electronics Forum | Wed Apr 27 02:22:08 EDT 2005 | grantp

Hi, There are a number of things you can try. You are already using 1:1 hole to pad ratio, and that's good as you need the size. I would try an electroform stencil as that will have a smooth side of the aperture and help paste release. Don't use c

UP1500 Frame Sizes?

Electronics Forum | Tue May 03 10:34:34 EDT 2005 | MikeaJ

If your image is not defined properly, it will affect positioning and optimization. You can choose center, rear or front image justification. If your values are grossly off, your positioning will be off, and you may not be able to optimize properly,

Stencil and board Ultrasonic cleaner

Electronics Forum | Wed Feb 01 13:46:05 EST 2006 | Chunks

Sounds like a epididymis! It depends on your paste chemistry. You can't just slap any old saponifier in there. Most water based cleaners evaporate the water and you have to remove the dried paste. It's a bit messy, maybe that's why your's is over

Stencil past height issue

Electronics Forum | Tue Feb 21 21:17:41 EST 2006 | Cal Kolokoy

M, The paste height is what you establish it as. You're probably using a laser measurement system, and these depend on where your reference datum is. Some will measure from a silkscreen, a trace, or solder mask. These add height, not to mention H

Fighting solder beads

Electronics Forum | Thu Mar 23 10:02:09 EST 2006 | Joe

Check placement pressure. I agree with the "smushing" theory. If you can place the component with less pressure, I'd do that first. A switch to Type three paste is also a good idea, as long as your minimum aperture dimension remains at 0.009" as you

Standard for Stencil printers edges pressure

Electronics Forum | Tue Apr 18 19:48:08 EDT 2006 | davef

There is no standard, nor should there be [because the IPC standards should be aimed at describing results, not the path used to reach the results]. So, your printer equipment supplier recommendations are a good starting point. Your "35-46 lbs-in"

MPM UP2000 Hi-e

Electronics Forum | Tue Sep 05 16:26:53 EDT 2006 | Bill

Thinking about this auto-mode on Grid-Lok..... Ok, the board is warped, lets say positively, the pins conform to the warped board... what about the effect on top side and squeegee pressure? It will be much higher and could damage stencils, right? Pos

Pasting ahead

Electronics Forum | Sat Nov 04 07:46:36 EST 2006 | itwasbill

Hi all, What are the pro's and cons of pasting ahead? The definition of pasting ahead for this question is the act of pasting 10 or 15 pc boards and then running then repeat. I do not like this philosophy. I'd prefer to paste, run, reflow then


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