Electronics Forum: stencil (Page 243 of 572)

Component pad design and volume requirements

Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas

hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a

Re: Solder Paste Height

Electronics Forum | Tue Jan 23 22:21:15 EST 2001 | rpereira

We have evaluated 4 different AOI machines and the General Scanning 8200 machine was the best. Great G R&R. As far as paste height goes, it is very paste dependant. I recently completed a DOE comparing laser stencils to EFab, varying 0.5 mm pitche

Re: solder balls on high temp.solder

Electronics Forum | Mon Dec 11 17:09:27 EST 2000 | Michael Parker

Get a profiler for your oven. To say "we are not sure" and "we think it might..." shows you are running with a WAG (Wild Ass Guess). Not a good place to be if you intend to produce anything reliable, with quality. Run your profile and verify that yo

Re: Stencil for 10 mils IC

Electronics Forum | Mon Nov 13 04:57:27 EST 2000 | Wolfgang Busko

Hi Richard, I assume that you deal with a component that has 20mil pitch. In this case depending on your pad design you get from 8 to 10mil spacing for your apertures. With a slight reduction of the aperture (10 to 15% for avoiding shorts)and a 6mil

How to do with tombstoning for component '0402'

Electronics Forum | Tue Oct 31 20:42:56 EST 2000 | speedy-tech

Now we are face with tombstoning for component '0402',we have tried many ways,it seems no change,Below is our experient: 1,The thickness of stencil is 0.12mm,and the aperture is circle.the diameter is 0.55mm.The pads size is 0.5*0.6. 2 Ch

Re: adhesive printing

Electronics Forum | Tue Oct 31 01:08:25 EST 2000 | Dreamsniper

Here are some: Printing Speed : 2.5 ips (inch per sec) Stencil Thickness: 10 - 12 mil but the latter is the best. Dots sizes: u can get that from the Forum Archive...I used Dave F's dot sizes recommendation...they are good! Squeegee Blade : use met

Re: 16 mil pitch QFP solder bridge

Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo

We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)

Stencil Printer for Lead Free Solder

Electronics Forum | Mon Sep 25 10:18:00 EDT 2000 | Vic Lau

Dear Friends, I am handling a new project, and search for a solder paste stencil printer (automatic or semi-automatic) for lead free solder paste. The one I had looked for is MPM3000 series, however, what I heard from other freinds, those model is

Re: Stencil Cleaner

Electronics Forum | Tue Aug 29 12:22:36 EDT 2000 | Mike Konrad

I�m sure others will spew out commercials as a response to your question, but I�ll refrain. Stencil cleaner manufacturers include: Aqueous Technologies (800) 218-8128 www.aqueoustech.com PMR (480) 829-8170 www.pmrsystems.com SmartSonic (818) 909-6

Re: Clamshell printers

Electronics Forum | Fri Aug 04 10:42:26 EDT 2000 | James

So Darby do you use your clamshell printers in production, if so what volume? Do you use a snap off distance? With our current printers the board is held with tooling pins, when the stencil is lifted the board has a tendency to stick and lift to so


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