Electronics Forum | Tue Jul 20 17:24:24 EDT 1999 | Deon Nungaray
| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste
Electronics Forum | Thu Jul 22 12:50:04 EDT 1999 | Jennifer
I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. Just out of curiosity, who's holding the market for the semi-automatic screen printers these days aside from Transition Automation? I know MPM offers
Electronics Forum | Mon Jun 28 11:51:36 EDT 1999 | Brian Wycoff
| | | | Dear guys, | | | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thicknes
Electronics Forum | Fri May 14 18:34:28 EDT 1999 | Earl Moon
| What is the best way to re-ball a BGA? Who has the best system for doing it? | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil, after clean
Electronics Forum | Wed Apr 28 14:41:45 EDT 1999 | Bob Willis
| | What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | | | Thanks, | | | | Frank | | | Frank, | Refer to the device manufacturers. they are going t
Electronics Forum | Tue Apr 06 10:30:48 EDT 1999 | Scott Davies
Tony Although I agree in principle with Dean that 45 Degrees would be ideal, most of the squeegees I have worked with have been 60 Degrees to the stencil surface. This seems to work best with metal squeegees when printing HASL boards, because the sl
Electronics Forum | Mon Mar 15 10:08:25 EST 1999 | Justin Medernach
| Can sombody help me with this?? When applying solder paste, what factors determine how high off the PCB the stencil is? We use no fine pitch devices. (mostly 603 and 1206 size components) Any help would be greatly appreciated. As you could probably
Electronics Forum | Tue Mar 16 03:16:18 EST 1999 | Scott Davies
| | Can sombody help me with this?? When applying solder paste, what factors determine how high off the PCB the stencil is? We use no fine pitch devices. (mostly 603 and 1206 size components) Any help would be greatly appreciated. As you could probab
Electronics Forum | Wed Dec 16 19:37:19 EST 1998 | Ron Costa
I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is 14
Electronics Forum | Mon Oct 19 17:40:01 EDT 1998 | Eric
Nate, If your stencil vendor has laser-cutting capabilities, they should be able to burn in your fiducial locations. This process involves re-setting the focus of the laser beam to burn the locations 1-3 mils into the surface (as opposed to 1/2 cut
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