Electronics Forum | Thu Jul 08 02:32:47 EDT 2010 | tivux
I soldered a wire in the tape press lever of th feeder, so as to create a small gap where the cover tape passes and the component doesn't: in this way the component is pushed down in the pocket as soon as it tries to follow the cover tape. regards,
Electronics Forum | Wed Jul 21 11:12:05 EDT 2010 | remullis
I have some 13" long boards that warp considerably during first pass through reflow (no center support), what I've done to improve this type of warpage is stiffeners along the front and back edge. This may help with twisted boards as well.
Electronics Forum | Fri Aug 13 17:45:43 EDT 2010 | bradlanger
Boards with the LF hasl finish applied too thin will genrally pass the IPC test. That is some pretty agressive flux they call out. The boards usually wave solder just fine as well. Reflow is where the you see the problem.
Electronics Forum | Tue Aug 03 16:12:54 EDT 2010 | namruht
Just to get the simple stuff out of the way. Make sure that no one has changed the machine nozzle data to a different type. Then try actually changing the nozzle data and putting that type into the head. If this passes it will at least eliminate the
Electronics Forum | Tue Oct 05 02:57:41 EDT 2010 | patejl
Reese is right. We use algorithm our AOI but the make it find liftead lead on qfp or such... it took me all day to set program and even then some defects pass so that is why Im asking..
Electronics Forum | Thu Mar 24 18:16:24 EDT 2011 | bandjwet
Dear SMTNetters: Does anyone have a good method for determining the solderability of leaded high power resistors? We currently are using Dip and Look and they always pass yet solderability issues remain... Thanks! BWET
Electronics Forum | Fri Jul 13 06:29:44 EDT 2012 | sunyb123
Pls suggest for by pass the chiller unit & nitrogen Gas supply from Unitherm SMR500 reflowe oven,can it possible to install the regular cooling fan in the machinefor Pcb cooling ?
Electronics Forum | Thu Jul 28 22:35:58 EDT 2011 | davef
The consequences of poor heel formation in solder connections include: * Lower solder joint strength * Possible intermittent short circuits * Reduced first-pass yields * Increased inspection cost * Increased rework cost * Likely field failures * Like
Electronics Forum | Mon Jan 21 08:26:45 EST 2013 | ngineer
Bobpan, Thanks for the reply. I have been using Tep Vision, I'll see whether I was using GOTO 1 or 0, it may have been 0. I am running from central controller, and am doing a download database from the database utilities when making changes on
Electronics Forum | Mon Apr 16 11:28:50 EDT 2012 | vparis
Hey Reese what is your Mis rate? Do you have any boards that are passed that have actual defects?
