Electronics Forum | Wed Feb 09 12:28:58 EST 2005 | Valerie
We have been pretty successful with screen printing glue, however the smallest component we now glue is a 0805. We had many problems using our Gemini II to put down glue dots for a 0603, so we altered the pads to do double-side reflow. As our own int
Electronics Forum | Thu Feb 10 09:14:09 EST 2005 | davef
Don't kid yourself, something has changed. * Worn stencils should produce better release and greater paste deposits than less worn stencils. * Consider inspecting the effectiveness of your cleaning process with a X10 magnifier. * Temperature in your
Electronics Forum | Tue Feb 22 10:44:12 EST 2005 | Dougs
when you talk about stencil design, what would you recommend for aperture size on fine pitch if the customer insists on hasl finish on fine pitch devices? i usually use a 10% reduction on everything we have been using ( 16mil pitch and upwards and 0
Electronics Forum | Thu Mar 03 18:09:06 EST 2005 | gpaelmo
We also use Indium NC-SMQ92J. We do the same as mentioned per Russ. We reduce apertures mostly on QFP's with pitch of 25 mil or less (we place down to 15 mil QFP). All other apertures we keep 1:1. We print resnet 0805 size with no problems. You might
Electronics Forum | Fri Mar 04 11:00:37 EST 2005 | mrduckmann2000
Anybody have any ideas on the proper way to screen solder mask onto a PCB? I am going to cover SMT parts that were soldered to the btm side of the PCB, now I have to mask them in order to run this animal through the wave solder process. I know it w
Electronics Forum | Sun Mar 06 20:12:53 EST 2005 | mrduckmann2000
Russ, I didn't use a stencil for my experiment because I was not sure that the solder mask idea would work. Now that I have treid a few experiments I feel dangerous! LOL. I will not have to use a step stencil, I will just mask all the parts. Lik
Electronics Forum | Mon Apr 11 15:37:29 EDT 2005 | GS
For 1,27 mm Column Pitch, we set our process like this: - Stencil 0,20 mm If allowed also for other SMDs otherways some time 0,150 with step up stencil used only for CCGA area. - paste height min 0,175 mm - aperture 0,75 to 0,8 mm - paste volum
Electronics Forum | Wed Apr 27 10:47:26 EDT 2005 | HOSS
A 1:1 pad to ball diameter will cause the balls to collapse more giving you less post solder component standoff. Depending on the application of this product and required reliability, you may want to stay with the padstack being used. You may try c
Electronics Forum | Mon May 02 10:49:10 EDT 2005 | pr
We are using a UP2000 so I'm not positive on this but.... The squeegee stroke will have to be taught by and the software will walk you through setting the stroke. What do you mean by "where it drops the pins to load/unload/locate"? If you follow th
Electronics Forum | Tue Jun 07 03:47:51 EDT 2005 | vera
hi solcom: kindly check the http://www.hkenterprise.com/szcomfaje we sell the stencil roll: 1)suited for machine:MPM,DEK,JUKI,ERKA,Minami etc. brands. 2)paper type:68g(C1,suitable for dry uses),60g(C100),55g,50g,40g(C60,suitable for vacuum absorbent
