Electronics Forum: rework (Page 257 of 293)

Re: Immersion Gold

Electronics Forum | Fri Oct 01 05:03:28 EDT 1999 | Wolfgang Busko

I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. What is the best way

Re: Serious stuff

Electronics Forum | Wed Aug 18 17:25:58 EDT 1999 | Earl Moon

OK folks, let's get real serious. Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. Anyway, I said it would ta

Micropax Connector Repair (Through Hole Version)

Electronics Forum | Fri Aug 13 07:11:12 EDT 1999 | Earl Moon

Ladies and Gentlemen, As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous insigh

Re: SMD Inspection and Touch-up

Electronics Forum | Fri Jul 23 23:47:03 EDT 1999 | Scott McKee

There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not perform

Re: SMD Inspection and Touch-up

Electronics Forum | Sat Jul 24 00:04:55 EDT 1999 | Scott McKee

There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not perform

Re: HASL - again?

Electronics Forum | Mon Jun 21 09:58:25 EDT 1999 | Christopher Cross

Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave revi

Re: uBGA's

Electronics Forum | Tue May 18 16:22:43 EDT 1999 | Earl Moon

Hi Guys, I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? So, any of you folks who

Re: reject percentage of assembled circuits after initial test?

Electronics Forum | Fri Jan 08 13:22:11 EST 1999 | Earl Moon

This is a question for those of you who actually assemble components onto a board. Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall qua

Re: reject percentage of assembled circuits after initial test?

Electronics Forum | Fri Jan 08 21:46:49 EST 1999 | Dean

This is a question for those of you who actually assemble components onto a board. Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall

Re: DPM-Rate for SMT pprocess

Electronics Forum | Wed Oct 07 06:19:30 EDT 1998 | Charles Stringer

Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? DPM is Defects per million, usually measured on components. We run a process consisting of small to medi


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