Electronics Forum: rework (Page 258 of 293)

Re: Adhesion of conformal coating to plastic components

Electronics Forum | Wed Jun 03 15:22:12 EDT 1998 | Greg Curler

We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan

Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Wed Jul 03 11:37:36 EDT 2002 | fmonette

Dason, I apologize if some of the information sounds redundant but I don't think I explained my point very well (and the standard can get really confusing at times). I definitely agree with using C-SAM to look for internal defects. My only advise i

BGA void removal

Electronics Forum | Sat Oct 19 08:33:50 EDT 2002 | johnw

The whole thread seem's to have gone off track. Russ we've been doing a fairly big bit of work on the whole BGA voidign thing as we were so unhappy with the answer's that we were getting from around the industry, basically no one really kows all the

Question of delamination in PCB

Electronics Forum | Thu May 07 20:28:35 EDT 2009 | davef

From our notes, the following is a series of snips from: "Copper Dissolution in Tin" LJ Turbini, PhD, adjunct faculty member, University of Toronto, Materials Science and Engineering, SMT 2/07 As the solder becomes molten, copper from the board diff

BGA Placement Process

Electronics Forum | Thu Mar 25 09:14:09 EDT 2010 | krish_bala

Hello, I have been having some troubling issues when it has come to BGA Placement and I was hoping if there have been others who have been able to resolve similar issues. We are curently doing reworks on a variety of BGA, but seem to be having issu

Re: CPH

Electronics Forum | Thu Feb 10 15:26:57 EST 2000 | Dean

Simplify. FInd your botle-neck process (use a stop watch). You assume it is a P&P machine...(it could also be print or glue etc.) Your only concern is that bottle neck process and how many parts / hour that process can deliver. That is your gatin

Re: Poor solderability

Electronics Forum | Thu Feb 10 10:28:56 EST 2000 | Russ

Okay, Okay, here is the rest of the story! These boards were definitely plated, reworked to HASL, The component that is the most succeptable is a 160 pin QFP .5mm pitch. This component has nickel/iron lead frame. Significantly reduced apertures (1

Re: Poor solderability

Electronics Forum | Thu Feb 10 13:01:29 EST 2000 | Wolfgang Busko

Hi Russ, yes, I did get the homeplate info, thanks. Thought that it looks that way, only didn�t know how to deal with that expression. Now your problem: it�s hard to tell without seeing it actually. All I wonder is this 80sec above liquidous, at what

Re: Poor solderability

Electronics Forum | Thu Feb 10 22:41:20 EST 2000 | Dave F

Russ: Now that�s a good story. Nuff said on the Vegas trip, that explains everything. Especially when you say "it must have something to do with ..." I love WS609. It�s been berry, berry good to me. Intermetalic Layer (IL). A compound formed a


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